Product News: Electronic Components & Devices
BGA Socket meets needs of high-speed (24 GBps) applications.
Press Release Summary:
November 27, 2012 - Designed for 19 x 19 mm, 1 mm pitch BGA package, SM-BGA-9019 connects all pins with 40 GHz bandwidth on all connections and mounts on target PCB without any soldering. Socket is constructed with double latch lid that incorporates quick insertion method, accelerating IC change-out. Along with less than 1 dB insertion loss, properties include 15 mΩ typ contact resistance per pin, -55 to +150°C operating range, 0.069 pF capacitance to ground, 4 A current capacity per pin, and pin self inductance of 0.10 nH and mutual inductance of 0.007 nH.
Original Press Release
Quickly and Easily Socket your 19x19mm, 1mm pitch BGA Packages on Any Application Board with Performance Equivalent to Direct Solder Version
Press release date: November 1, 2012
The SM-BGA-9019 socket is constructed with high performance and low inductance elastomer contactor. The temperature range is -55 C to +150 C. The pin self inductance is 0.10 nH and mutual inductance of 0.007 nH. Capacitance to ground is 0.069 pF. Current capacity is 4 amps per pin. This BGA socket is specifically designed to work with bandwidth engine IC for 10G serial interfaces which provide peak data throughput of 24 GB per second.
Pricing for the SM-BGA-9019 is $1645 at qty 1; with reduced pricing available depending on quantity required.
For a high resolution photo see: http://www.ironwoodelectronics.com/press/PressReleasePhotos/C11699a_highres.jpg
Feel free to call or email if you have questions.
Ila Pal | VP Marketing | Ironwood Electronics | 1335 Eagandale Ct | Eagan | MN 55121
High Performance IC Sockets and Adapters | ISO 9001:2008 | www.ironwoodelectronics.com
T: 800-404-0204 | M: 651-900-1471 | email@example.com | Skype: ila.pal | www.linkedin.com/in/ilapal