Product News: Adhesives & Sealants
Assembly Adhesive suits edgebonding applications.
Press Release Summary:
November 7, 2013 - Designed for rapid ruggedization of circuit board components, Ultra Light-Weld® 9309-SC cures upon exposure to UV/visible light. Adhesive is compatible with both needle and jet dispensing systems and is highly thixotropic, minimizing movement after dispense. Formulated with patented See-Cure technology, 9309-SC is bright blue in uncured state, enabling automated vision systems and manual operations to confirm placement prior to cure. As product cures, blue color transitions to colorless.
Original Press Release
New Edgebond/Cornerbond Material for Rapid, Economical Ruggedization
Press release date: October 30, 2013
Formulated with patented See-Cure technology, 9309-SC is bright blue in an uncured state, enabling automated vision systems and manual operations to confirm placement prior to cure. As the product cures with sufficient exposure, its blue color transitions to colorless and provides obvious visual confirmation that the adhesive is fully cured and the bond site is secure.
9309-SC edgebond/cornerbond material is a significant addition to the Dymax portfolio of printed circuit board assembly materials, which include conformal coatings, encapsulants, and potting products, as well as masking materials and other related products.
For additional information, visit www.dymax.com or contact Dymax Application Engineering at firstname.lastname@example.org or 860-482-1010. Dymax Corporation develops innovative oligomer, adhesive, coating, dispensing, and light-curing systems for applications in a wide range of markets. Major markets include aerospace, appliance, automotive, electronics, industrial, medical device, and metal finishing.