Product News: Materials & Material Processing
Advanced Reflow Systems include batch ovens and inline variants.
Press Release Summary:
March 10, 2014 - Via combination of hot air reflow, nitrogen purge, and heat circulation vacuum, Eightech Vacuum Reflow RNV Series can reduce presence of solder joint voids when soldering larger PCBs and area-array packages. Flux-free soldering, accomplished by utilizing vacuum reflow in combination with hydrogen/formic acid, provides such benefits as no-flux wash process, minimized influences on insulation resistance and ion migration, as well as void-free soldering.
Original Press Release
Seika Releases the Eightech Vacuum Reflow RNV Series in North America
Press release date: February 1, 2014
The Eightech Vacuum Reflow RNV Series of advanced reflow systems can reduce the presence of solder joint voids significantly when soldering larger PCBs and area-array packages. This can be achieved with a combination of hot air reflow, nitrogen purge and heat circulation vacuum. Features include ultra-low power consumption, an efficient and large capacity flux recovery system, soldering capability of heat sinks with metal substrates, and fast tact time.
Eightech flux-free soldering by means of utilizing the vacuum reflow in combination with hydrogen/formic acid provides benefits such as a no-flux wash process, lowered influences on insulation resistance and ion migration, and void-free soldering.
The series of models offered include batch ovens for prototype and lab applications, and inline systems for volume and higher temperature applications.
The Eightech Vacuum Reflow RNV Series will be displayed for the first time in the US at the IPC APEX EXPO in Las Vegas from March 25-27, 2014. For more information, visit www.seikausa.com.
About Seika Machinery, Inc.
Seika Machinery, Inc. (SMI) is a subsidiary of Seika Corporation, Japan and member of the Mitsubishi Global Group. SMI provides electronics manufacturers with advanced machinery, superior materials and engineering services.