X-Ray Metrology Tool measures thickness from 1 nm to 10 µm.
August 4, 2005 - BedeMetrix™-F delivers non-destructive film thickness measurement on patterned wafers through combined x-ray reflectivity and x-ray fluorescence. Small spot x-ray optics enable measurement on test pads and in scribe lines down to 100 µm for XRR and 30 µm for XRF. BedeMetrix™-F is available in 3 primary configurations for strained silicon, metal film structure determination, and high-speed thickness measurement.
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Original Press release
Bede
Belmont Business Park
Durham, , DH1 1TW
United Kingdom
BedeMetrix™-F Offers Combined XRR/XRF Capability for High Speed Film Thickness Measurements on Patterned Wafers
DURHAM, UK – The latest variant of the BedeMetrix™-F X-ray metrology tool delivers non-destructive, high speed film thickness measurement on patterned wafers through combined XRR (X-ray Reflectivity) and XRF (X-ray Flourescence), providing an extended thickness measurement range of 1 nm to 10 µm on a wide range of material types. Proprietary small spot X-ray optics enable measurement on test pads and in scribe lines down to 100 µm for XRR and 30 µm for XRF, for in-line measurement on product wafers.
The family of BedeMetrix™-F tools offers fully-automated X-ray metrology for high volume semiconductor manufacturing. Proven at leading global manufacturers in 24/7 production environments, the tools deliver internally calibrated, non-destructive control of advanced semiconductor processes. With no lower thickness limit, the BedeMetrix™-F offers customers a future-proof metrology solution for most critical technologies on the ITRS roadmap.
Dr Neil Loxley, CEO of Bede comments: “Combined XRR/XRF adds a powerful new capability to the production-proven BedeMetrix™ family of X-ray metrology tools.
With high speed measurement of 1 nm to 10 µm thick films on product wafers, Bede X-ray metrology tools deliver an essential solution for manufacturing processes at current and future technology nodes”.
The BedeMetrix™ family of X-ray metrology tools consists of the BedeMetrix™-L process development tool and the BedeMetrix™-F tools for dedicated process control. The BedeMetrix™-F is available in three primary configurations for strained silicon, metal film structure determination, and high speed thickness measurement.
Bede is the global leader in non-destructive X-ray metrology tools for the semiconductor industry.
Bede was founded in 1978 and is headquartered in Durham, UK. The company has sales and service offices in Denver, Colorado (USA) and Shanghai, China, as well as a global network of distributors. In Prague, Czech Republic, Reflex sro operates as a subsidiary of Bede and provides specialist X-ray technology to the Bede Group.
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