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X-Ray Inspection System meets needs of electronics industry.

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X-Ray Inspection System meets needs of electronics industry.
X-Ray Inspection System meets needs of electronics industry.
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August 1, 2012 - Used for electronics assembly inspection, X8011 is available in basic, plus, and flex versions. Image quality, simplicity and speed of operation, and focused analyses are optimized to cover requirements of electronics assembly production. Functionality accommodates increasing use of BGA, QFP, and THT components as well as application fields such as inspection of surface-soldered connections.

Viscom Strengthens Its Manual and Semiautomatic Inspection for the Electronics Industry

(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)

Viscom USA
3290 Green Pointe Parkway
Atlanta, GA, 30092

Press release date: July 1, 2012

Hanover - Over the past year, Viscom AG, Hanover, has strengthened its activities in the areas of manual and semiautomatic X-ray inspection and intensified the technical development of X-ray inspection for the electronics industry. With the redesign of the successful X8011, the inspection system now is available in three versions (basic, plus, flex) for fast, effective electronics assembly inspection. Particular attention was placed on simple and fast operation. In the context of these future-oriented developments, sales activities also were strengthened.

With its own development team, production and sales, Viscom is well-equipped to quickly react to market demands. Thus, the X8011 inspection system has undergone further development for fast and effective electronics assembly inspection. With its superb image quality, simple and fast operation, and analyses directed especially to this area, this system optimally covers the requirements of electronics assembly production.

The rising demand for solutions for nondestructive testing of interior connections validates the company in its current orientation. Due to the ever-decreasing size of components and increasing packaging density, many electronics manufacturers no longer can do without X-ray inspection. Increased use of BGA and QFP components make X-ray penetration necessary. The requirements are additionally sharpened with the inspection of THT components. New application fields such as inspection of surface-soldered connections are found in the regenerative energies sector.

Rolf Demitz, vice president for the new products business unit at Viscom, who as of now also is responsible for manual and semiautomatic X-ray inspection, sees great market opportunities here: "I am very pleased to advance this promising business. With the redesign of the X8011, we have already started along the way and now can offer our customers a high-performance, innovative system with superb image quality targeted specifically to electronics assembly inspection at market-oriented prices. This application is further supported and supplemented by the deployment of the high-performance computed tomography we have developed to enable the reconstruction of complex structures."

In the context of these developments, sales activities also have been redirected. Since April 2012, Christian Wolff has been responsible for the technical sales of manual and semiautomatic X-ray inspection systems at Viscom. He supports the branches and worldwide representatives with questions concerning X-ray applications and the opening of new markets.
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