Wire Bonded Fuse suits sensitive electronic circuits.
January 6, 2010 -
Rated from 160-250 mA, Model USFF 1206 offers voltage drop value of 87 mV at rated current. Wire bonding makes fuse stable with operating temperature range of -55 to 90°C. RoHS-compliant and halogen-free, unit includes cURus agency approval and is especially designed for protecting DC over-current conditions where heat dissipation is critical, including computer peripherals and communication equipment.
(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)
Original Press release
Schurter, Inc.
447 Aviation Boulevard
Santa Rosa, CA, 95403
USA
Fuse, 1206 Footprint, Offers Low Current Ratings in Compact Design
USFF 1206: Low impedance fuse for high sensitive electronic circuits
Schurter introduces the new USFF 1206 fuses with super-quick-acting characteristic for low current applications. The new product extends the current range of the successful USF 1206 for lower ratings ranging from 160 to 250 mA. The wire bonded fuse offers extremely low impedance values compared to competitive products, providing exceptional performance in dense circuits.
Unlike competing fuses, the USFF 1206 200 mA version offers a voltage drop value at rated current of 87 mV, which is about 3 times less than competive products. The wire bonding makes the fuse stable and reliable with an operating temperature range of -55 °C to 90 °C. It is especially designed for protecting DC over-current conditions where heat dissipation is critical, including computer peripherals and communication equipment. The product includes cURus agency approval and is RoHS compliant and halogen-free.
|
|
|
|
|
|
|
| 
