Wave Soldering Systems utilize lead-free upgrades.
August 12, 2005 - Electrovert EconoPak Gold®, Electra®, and Vectra® Wave Soldering Systems may be fitted with UltraFill™ Nozzle, designed to increase contact length and dwell time. Nozzle also reduces temperature drop so that minimal superheat is needed to reflow solder joints in second wave. Also available, Quick Change Solder Pot provides capability to switch between 2 alloys. It includes second solder pot with motors, pumps, flow ducts, nozzle, and 2 trolleys.
(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)
Original Press release
Speedline Technologies Inc.
16 Forge Park
Franklin, MA, 02038
USA
Speedline Technologies Announces Lead-Free Upgrades for Electrovert Wave Soldering Systems
FRANKLIN, MASSACHUSETTS, USA, August 8, 2005 – Speedline Technologies has announced several important lead-free upgrades for its line of Electrovert Wave Soldering Systems for electronics manufacturers.
“The upgrades, which include the new UltraFill™ Nozzle and Quick Change Solder Pot, deliver powerful new capabilities and productivity improvements to electronics manufacturers seeking efficient and cost-effective solutions in their transition to lead-free operations,” said Richard Burke, Speedline Technologies, Product Manager, Electrovert Products.
Forty percent wider than the traditional tin/lead nozzle, the new UltraFill Nozzle increases both contact length and dwell time. The nozzles are placed closer together to reduce the temperature drop between the nozzles – so that less superheat is needed to reflow solder joints in the second wave. As a result, hole fill is improved and bridging is reduced. Moreover, there’s no requirement to slow the conveyor and dross generation is reduced. The nozzles are available in Melonite Corrosion Resistant Stainless Steel or Titanium Material designs.
An optional Nitrogen shroud is available for use with the UltraFill Nozzle. The shroud allows for either air or nitrogen operation, as determined by the desired recipe, without the need to change nozzles. The shroud both encompasses the nozzles in the pot and reduces dross formation in nitrogen environments. The shroud lifts for easy maintenance and dedrossing – without nozzle removal.
The Quick Change Solder Pot provides the capability to easily switch between two alloys, such as between tin/lead and lead-free solders – for significant labor savings versus a traditional manual changeover. The unit includes a second solder pot with motors, pumps, flow ducts, nozzle and 2 trolleys.
Both upgrades are available as an option on new or existing, installed Electrovert EconoPak Gold®, Electra®, and Vectra® Wave Soldering Systems.
Other available upgrades, compatible with a variety of new or installed Electrovert systems, include:
• High Velocity Convention (HVC) Topside Preheater, designed for even topside preheating and tighter Delta T’s across the board;
• Reciprocating Spray Fluxing Technology, featuring UltraSpray® technology for precise flux deposition, improved through-hole penetration and low maintenance requirements;
• Vectaheat Bottomside Preheater, providing efficient, even high thermal mass heating.
All upgrades are available immediately from Speedline distributors and representatives. For additional information, contact Speedline Technologies at 1-508-520-0083 or visit http://www.speedlinetech.com.
About Speedline Technologies
Speedline Technologies is the global leader in process knowledge and expertise for the PCB assembly and semiconductor industries. Based in Franklin, Massachusetts, U.S.A., the company markets five best-in-class brands — Accel microelectronics cleaning equipment; Camalot dispensing systems; Electrovert wave soldering, reflow soldering, and cleaning equipment; MPM stencil and screen printing systems; and Protect global services, support, and training solutions. Speedline was named as the “2005 Surface Mount Technology Company of the Year” by Frost & Sullivan.
For more information, visit us at http://www.speedlinetech.com, or contact us at:
• USA: Speedline Technologies, 16 Forge Park, Franklin, MA 02038 USA, Tel: 1-508-520-0083, Fax: 1-508-520-2288, E-mail: info@speedlinetech.com;
• Europe: Speedline Technologies GmbH, Im Gefierth 14, 63303 Dreieich, Germany, Tel: +49 (0)6103/832-0, Fax: +49(0)6103/832-299, E-mail: info.europe@speedlinetech.com;
• Asia: Speedline Technologies Asia Pte Ltd, 150 Kampong Ampat, #05-08 KA Centre, Singapore 368324, Tel: 65-6286-6635, Fax: 65-6289-9411, E-mail: asiamarketing@speedlinetech.com. |
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