ThomasNet Home   |   Promote Your Business
Home  |   My ThomasNet News®  |   Industry Market Trends  |   Submit Release  |   Advertise  |   About Us May 26, 2012  

Water-Debondable Epoxy facilitates solar silicon wafer slicing.

Print | 
Email |  Comment   Share  
Water-Debondable Epoxy facilitates solar silicon wafer slicing.
Water-Debondable Epoxy facilitates solar silicon wafer slicing.

Click Here to Enlarge Picture

August 19, 2011 - Providing optimal bond strength to both silicon and glass and metal mounting substrates used during ingot sawing process, LoctiteŽ 3382(TM) protects against wafer breakage. Two-part epoxy adhesive breaks down on exposure to hot water, eliminating corrosive debonding solutions and minimizing silicon waste that occurs during wafer cleaning process. Homogenous and stable, LoctiteŽ 3382(TM) sets up in 5-7 hours, emits no caustic odor, and will not corrode equipment.
Original Press release

Henkel Corporation
One Henkel Way
Rocky Hill, CT, 06067
USA



New Hot Water Debondable Epoxy Simplifies Solar Silicon Wafer Slicing


SIMPLIFIES SOLAR SILICON WAFER SLICING

LoctiteŽ Adhesive Eliminates Acids and Minimizes Wafer Damage

Rocky Hill, Conn. -- To simplify silicone ingot bonding and protect against wafer breakage, Henkel Corporation has introduced LoctiteŽ 3382(TM), a water-debondable epoxy adhesive that provides excellent bond strength to both silicon and the glass and metal mounting substrates used during the ingot sawing process.

LoctiteŽ 3382(TM) replaces traditional epoxies that require caustic acids for debonding. This adhesive breaks down easily on exposure to hot water, eliminating corrosive debonding solutions and minimizing silicon waste that occurs during the wafer cleaning process.

As this two-part epoxy is pink when cured, it is easy to distinguish from the silicon ingot and the metal and glass mounting substrates during visual inspections. Easy to dispense using meter-mix equipment, LoctiteŽ 3382(TM) is packaged in cartridges, pails and drums. This adhesive emits no caustic odor, will not corrode equipment, and is fully-compatible with current wafer cleaning solutions and processes.

Homogenous and stable, LoctiteŽ 3382(TM) sets up in just 5 to 7 hours and provides a consistent cutting layer that reduces edge damage and wafer breakage. This epoxy's excellent bond strength means the adhesive will not prematurely debond during the sawing process, protecting the ingot and the wafers from damage.

For more information on LoctiteŽ 3382(TM), call 1-800-562-8483 or visit www.henkelna.com/solar.

Henkel operates worldwide with leading brands and technologies in three business areas: Laundry & Home Care, Cosmetics/Toiletries, and Adhesive Technologies. Founded in 1876, Henkel holds globally leading market positions both in the consumer and industrial businesses with well-known brands such as Persil, Schwarzkopf and Loctite. Henkel employs about 48,000 people and reported sales of $20.07 billion and adjusted operating profit of $2.27 billion in fiscal 2010. Henkel's preferred shares are listed in the German stock index DAX and the company ranks among the Fortune Global 500.
Print | 
Email |  Comment   Share  
Contacts: View detailed contact information.


 

Post a comment about this story

Name:
E-mail:
(your e-mail address will not be posted)
Comment title:
Comment:
To submit comment, enter the security code shown below and press 'Post Comment'.
 



 See related product stories
More .....
Don’t hunt for stories like this.
Let Adhesives & Sealants
Product News Come to You!
Get a Free Subscription
to Product News Alerts.
Start Your Free
Subscription to
Industry Market Trends.
 See more product news in:
Adhesives and Sealants
 More New Product News from this company:
Threadlockers achieve No. 1 safety rating.
Hand Pump precisely dispenses instant adhesives.
Electrically Conductive Adhesive is used with tin-terminated components.
Sprayable Ceramic Coating features reusable cartridge dispenser.
Polyurethane Adhesive suits wind blades and turbine assemblies.
More ....
 Other News from this company:
Henkel Develops Materials Innovations for High Power Electronics
Henkel Reconfirms 2012 Targets
Henkel Chipbonder Compatible with Non-Contact Dispensing Technology; Enables Higher Throughput and More Uniform Dot Dimensions
New Literature from Henkel Focuses on Solutions for the Photovoltaic Industry
Henkel-Sponsored Motor Sports Program Encourages Wounded Warriors
More ....
 Tools for you
Watch Company 
View Company Profile
Company web site
More news from this company
E-Mail Story
Save Story
Search for suppliers of
Epoxies
Epoxy Adhesives
Join the forum discussion at:
Hard to Handle


Home  |  My ThomasNet News®  |  Industry Market Trends  |  Submit Release  |  Advertise  |  Contact News  |  About Us
Brought to you by Thomasnet.com        Browse ThomasNet Directory

Copyright © 2012 Thomas Publishing Company
Terms of Use - Privacy Policy



Error close

Please enter a valid email address