Wafer Plating Tool suits R/D and low-volume applications.November 10, 2010 -
Featuring single plating cell and dragout rinse cell, SEMCON 1000 provides uniform plating of most patterned wafers, MEMS-based substrates, and similar applications. Plating cell components include heating temperature control, low level safety device, pump and filter, DC power supply, and wafer holder. Self-contained solution is constructed of white polypropylene with clear PVC process cover designed to meet class 1000 clean room specification.
(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)
Original Press release
Technic Inc./Surface Finishing Technologies (SFT)
12200 34th St. North
Clearwater, FL, 33762
USA
SFT Introduces Wafer Plating Tool for R&D Applications
Clearwater, FL - Surface Finishing Technologies (SFT) a Division of Technic Inc. announces the latest addition to the company's line of semiconductor wafer plating tools: the SEMCON 1000. Developed to meet the needs of the R&D markets in university research and small company laboratories, the SEMCON 1000 provides uniform plating of most patterned wafers, MEMS-based substrates, and similar applications. The SEMCON 1000 incorporates the same basic cell design featured in SFT's higher end SEMCON 2000 & 3000 series and can achieve the same high quality plating results at a much lower cost.
For over 50 years, Technic has been a worldwide supplier of both plating chemistry and equipment. Technic provides proprietary chemistries and specialized custom plating equipment and supplies to the semiconductor, electronics, printed circuit, automotive, and general metal finishing industries.
For more information: info@sft-technic.com
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