Vertical Turning Machine operates using pendulum technology.
November 27, 2012 -
Featuring 2-spindle design, Model VL 2 P is capable of machining workpieces up to 100 mm in diameter. While one workpiece is being machined, second spindle automatically loads itself using pick-up method. Machine features polymer concrete body and vertical design, which ensures optimal chip flow conditions. Whether manufacturing small chuck parts or larger components, Model VL 2 P ensures accurate component geometry.
Perfect Performance for Turning and Grinding Processes
(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)
38800 Grand River Ave.
Farmington Hills, MI, 48335
Press release date: November 26, 2012
High component quality with low production costs is required in many applications involving machining chucked parts and the new VL 2 P is a vertical pick-up turning machine which operates using pendulum technology.
Whether you want to manufacture small chuck parts or larger components, the machining processes must ensure accurate component geometry while also guaranteeing low component costs. These requirements and more are met with the VL 2 P vertical turning machine from EMAG. The advance in productivity is provided by the EMAG design of these machines with the integrated pick-up automation and a machine body made of polymer concrete as well as the vertical design which ensures perfect chip flow conditions.
VL 2 P: Swinging to success
Workpieces up to 100 mm in diameter can be machined in full on the innovative VL 2 P, a two-spindle turning machine. The machine has two spindles because while one workpiece is being machined, the second spindle automatically loads itself using the pick-up method. This means that the next raw part is immediately ready for machining, resulting in extremely short chip-to-chip times. The focus during the design of this machine was efficiency and eliminating idle times. The VL 2 P also has an incredibly small footprint due to its compact design, which helps decrease the chip-to-chip times.