Ultrasonic Spray Fluxing System offers non-clogging design.
August 1, 2002 - SonoFlux XL, used for wave solder processes, offers high-velocity flux transfer system that produces maximum topside fill without creating unwanted overspray. It includes self-cleaning design and can uniformly cover 2 to 24 in. PCBs. Unit has stationary, ultrasonic nozzle and software that integrates with wave solder machines. Compatible with all fluxes (VOC Free, No-Clean, Water Soluable, Rosin), it retrofits to existing wave solder machines.
(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)
Original Press release
Sono-Tek Corp.
2012-A Route 9W, Bldg. 3
Milton, NY, 12547
USA
SonoFlux XL
The new SonoFlux XL - the next generation in spray fluxing - used for conventional wave solder processes, features a high-velocity flux transfer system that produces maximum topside fill without creating unwanted overspray. The SonoFlux XL also includes a new self-cleaning design and can uniformly cover 2" to 24" PCB's. The SonoFlux XL has a stationary, non-clogging ultrasonic nozzle, and software integration with all major wave solder machines. Benefits of using the SonoFlux include reduction in flux consumption up to 80% and the elimination of thinner. The system is compatible with all fluxes (VOC Free, No-Clean, Water Soluable, Rosin). Available to retrofit into any wave solder machine and a stand alone version is also available.
Technical Sales Contact:
harsh@sono-tek.com
Steve Harshbarger, VP/Sales
Tel: 845 795 2020 ext 124
Company info:
Assy' Tech Expo Booth # 55050
Sono-Tek Corporation
2012 Route 9w
Milton, NY 12547
email: info@sono-tek.com
web site: http://www.sprayfluxing.com/
Tel: 845 795 2020; Fax: 845 795 2720
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