Ultra Fine Pitch Connectors achieve 25+ Gbps performance.
Press Release Summary:
Intended for applications where space is limited, Razor Beam™ LP SS5/ST5 Series comprises ultra-fine pitch 0.50 mm socket and terminal connector strips available in 4, 4.5, and 5 mm stack heights. Models with 4.00 mm stack height are rated at 13 GHz based on -3 dB insertion loss point of system. Double row systems, offering choice of 20, 30, or 40 positions, include gold plated contacts and surface mount tails. With 5 mm body width, self-mating systems optimize PCB space.
Original Press Release:
Samtec's New Low Profile, Ultra Fine Pitch Connector Achieves 25+ Gbps Performance
Samtec has expanded its Razor Beam™ LP product line to include a new ultra fine pitch, low profile system for applications where space is limited and high speed performance is required. The ultra-fine pitch 0,50 mm socket and terminal connector strips (SS5/ST5 Series) are available in 4 mm, 4,5 mm and 5 mm stack heights. The 4,00 mm stack height system is rated at 13 GHz (26 Gbps) based on a -3dB insertion loss point of the system. Â
This new Razor Beam™ LP double row system increases design flexibility with a choice of 20, 30 or 40 positions. The narrow 5 mm body width of this two-piece system optimizes PCB board space, gold plated contacts provide high reliability for increased mating cycles, and surface mount tails ensure board level stability.
Razor Beam™ LP products include an ultra fine 0,40 mm pitch system (SS4/ST4 Series) with stack heights from 4 mm to 6 mm and up to 100 total positions. Also available is a low profile, 0,50 mm pitch, terminal and socket system (SSH/STH Series) with stack heights from 2 mm to 3 mm.
The Razor Beam™ family of interconnects includes micro rugged hermaphroditic interfaces for high speed/high density applications. These self-mating systems reduce inventory costs and are available in a variety of pitches and lead styles for increased flexibility. Â
As with all of Samtec’s high speed products, customers have full access to Samtec’s Signal Integrity Group of specialized for support with the selection, development, simulation, and testing of your high speed system. This group is dedicated to not only developing high speed products, but also the generating the design tools you need such as models for simulation (SPICE and Touchstone models), test reports, time and frequency domain test data, and a variety of footprint libraries.
For product specifications, see www.samtec.com?SS5 and www.samtec.com?ST5
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