Thermoelectric Cooling Modules suit high power laser diodes.October 5, 2005 -
Utilizing DCS technology, Cold Plates enable scalable cooling and mitigate heat-spreading problem of using both heatsink and cold plate. Technology is targeted for cooling high power laser diodes such as those found in material processing lasers, medical research, and high power fiber lasers. All cold plates have mounting patterns for most diodes, and custom patterns are available upon request.
(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)
Original Press release
Elite Thermal Engineering
22914 11th Ave, W
Bothell, WA, 98021
USA
High Power Laser Diodes Can Dump Their Water Chillers and Find Solid-State Cooling Solutions on Elitethermalengineering.Com
Elitethermalenginering.com, a thermal management company focusing on photonics cooling solutions, recently released a series of high performance, high power thermoelectric cooling modules (cold plates) that are designed specifically for high power laser diodes. All their cold plates have the mounting patterns for most of the diodes it intent to cool, and custom patterns are available upon request.
Conventional cooling modules consist of a cold plate and a heatsink with thermoelectric coolers (TEC) sandwiched in between. As laser diode power grows ever higher, people add more TECs between the cold plate and heatsink, and increase the size of heatsink to meet the heat sinking demand. But as the power and number of TECs increases, maintaining near perfect thermal interface becomes increasingly difficult, and spreading heat over a large heatsink becomes very costly. The efficacy of cooling modules decreases as the cooling demand increases. The maximum cooling capacity of commercially available cooling module is stagnated at about 220w as the press time because of the deficiencies mentioned here.
To make matters worse for cooling laser diodes is the spreading resistance of the cold plate itself--- the conventional cooling modules usually specify the cooling capacity based on uniform heat load to the cold plate. But laser diodes have extremely concentrated heat load that is very sensitive to spreading resistance. A laser diode that dissipates 50w of heat may need a 100w cold plate because of the heat-spreading resistance of the cold plate.
The engineering team at ETE (Elite Thermal Engineering) developed their cooling modules using their proprietary DCS technology that enables scaleable cooling modules that can offer much higher cooling capability. The DCS technology also mitigated the heat-spreading problem of both the heatsink and cold plate. The performance specification of ETE's cooling modules have accounted for the spreading resistance for laser diodes.
This technology is particularly crucial for cooling high power laser diodes such as those found in material processing lasers, medical research and high power fiber lasers. Most of the high power laser diodes need to be cooled by liquid because of the limitation of conventional cold plates. Chillers used for liquid cooling are heavy, expensive and less reliable comparing solid-state cooling systems. It is also very hard to develop compact laser systems with liquid cooling. DCS technology offers solutions for either direct cooling laser diodes with compact cold plates, or liquid cooling using ETE's discrete liquid cooling system which is also based on solid-state cooling with DCS technology.
ETE is seeking strategic partnerships with major laser diode manufactures to provide turnkey laser solutions to their customers.
Please visit www.elitethermalengineering.com or email info@elitethermalengineering.com for more information.
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