Thermoelectric Cooling Assemblies feature cross flow technology.December 14, 2009 -
Suited for cooling applications with tight geometric space constraints, Tunnel Series maximizes heat transfer when pulling air through heat exchanger. Heat is absorbed and dissipated through high-density heat sink equipped with metal shrouds and fans. Air-Air Models AA-027-12-22 and AA-035-24-22 utilize convection cooling method, while Direct-Air Models DA-033-12-02 and DA-039-12-02 utilize conduction cooling.
(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)
Original Press release
Laird Technologies
16401 Swingley Ridge Rd., Suite 600
Chesterfield, MO, 63017
USA
Laird Technologies Releases the Next Generation of Tunnel Series Thermoelectric Assemblies
Compact Design Yields Higher Cooling Performance, Less Power Consumption
St. Louis, Missouri, USA - - Laird Technologies, Inc., a global leader in the design and manufacture of customized, performance-critical components for wireless systems and other advanced electronics applications, today announced the release of its newly modified Tunnel Series Thermoelectric Assemblies (TEAs).
The Tunnel Series TEAs are designed with a patented, high-performance cross flow technology maximizing heat transfer when pulling air through a heat exchanger. Heat is absorbed and dissipated through a high density heat sink equipped with sheet metal shrouds and fans. The number of airflow paths required is minimized when compared to traditional impingement flow TEAs. The Thermoelectric Modules (TEMs) are custom designed to achieve a high coefficient of performance (COP) to minimize power consumption with reliable solid-state operation that does not use a compressor or CFC refrigerants.
The Tunnel Series TEAs are available in two cooling configurations:
o Air-Air (AA) - Convection cooling method where heat is absorbed and dissipated by heat exchangers equipped with fans. Products in this series include AA-027-12-22 and AA-035-24-22.
o Direct-Air (DA) - Conduction cooling method where heat is absorbed through a cold plate, pumping the heat through the TEM and dissipating it into the air through a heat sink equipped with a fan. Products in this series include DA-033-12-02 and DA-039-12-02.
"Conventional TEAs use impingement flow to convect heat from heat exchangers. This can pose a challenge for medical, analytical and photonics instruments with tight geometric space constraints," stated Andrew Dereka, Laird Technologies Thermoelectrics Product Manager. "The Tunnel Series are compact TEAs that maximize cooling capacity and efficiency, while minimizing the number of air circulation paths required to operate properly."
The Tunnel Series TEAs are ideal for use in cooling applications with tight geometric space constraints by offering greater performance, higher reliability, and low cost of ownership. Their advanced capabilities are aided by new material technologies, thinner profiles, and automated assembly.
About Laird Technologies, Inc.
Laird Technologies designs and manufactures customized, performance-critical products for wireless and other advanced electronics applications. The company is a global market leader in the design and supply of electromagnetic interference (EMI) shielding, thermal management products, mechanical actuation systems, signal integrity components, and wireless antennae solutions, as well as radio frequency (RF) modules and systems.
Custom products are supplied to all sectors of the electronics industry including the handset, telecommunications, data transfer and information technology, automotive, aerospace, defense, consumer, medical, and industrial markets.
Laird Technologies, a unit of Laird PLC, employs over 10,000 employees in more than 39 facilities located in 13 countries.
Contact Information
For additional information, visit http://www.lairdtech.com or contact us at:
Americas: +1.888.246.9050
Europe: +46.31.420530
Asia: +86.755.2714.1166
e-mail: clv.customerpos@lairdtech.com
Trademarks
© 2009 All rights reserved. Laird Technologies and its logo are trademarks of Laird Technologies, Inc. Other products, logos, and company names mentioned herein, may be trademarks of their respective owners.
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