Thermoelectric Cooler operates at low currents.
January 29, 2009 -
Designed for optoelectronics and telecommunications industries, OptoCooler HV14 is optimized for standard circuitry and power requirements. It can pump up to 1.5 W of heat and operates at max voltage of 2.7 V and peak current of 1 A. Occupying 2.8 mm² footprint, unit can create temperature differential up to 51°C between its hot and cold sides. Thermal Copper Pillar Bump acts as solid-state heat pump to add thermal management functionality locally on surface.
(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)
Original Press release
Nextreme Thermal Solutions
3908 Patriot Drive, Suite 204
Durham, NC, 27003
USA
Nextreme Ships New Optocooler HV14 High Voltage, Low Current Thermoelectric Module
DURHAM, N.C. (January 20, 2009) - Nextreme Thermal Solutions, the leader in microscale thermal and power management products for the electronics industry, today announced the first customer shipment of the new OptoCooler HV14 thermoelectric cooler, the first module in a new class of high voltage and high heat pumping thermoelectric coolers that operate at low currents and are optimized for standard circuitry and power requirements. The OptoCooler HV14 is the latest product in Nextreme's OptoCooler(TM) family of thermoelectric coolers designed specifically for the optoelectronics and telecommunications industries.
The OptoCooler HV14 can pump up to 1.5W of heat and operates at a maximum voltage of 2.7V and a peak current of around 1A, with a footprint of only 2.8 mm2. The module can create a temperature differential (delta T) of up to 51°C between its hot and cold sides, making it ideally suited for the cooling and temperature control of optoelectronic devices such as laser diodes for transmission modules and photodiodes for sensing.
At the core of the OptoCooler module is Nextreme's breakthrough Thermal Copper Pillar Bump that acts as a solid-state heat pump to add thermal management functionality locally on the surface of a chip or other electrical component. By cooling at the source with the smallest devices on the market, customers are offered a unique approach to solving thermal design challenges.
The new HV Series allows for easy integration into existing control systems with compatible voltage and current specifications.
Nextreme will be demonstrating their cooling and thermal management product family, including the HV14 module, at the Photonics West conference, January 27-29, 2009 in booth #6198A at the San Jose Convention Center, South Hall 1.
The OptoCooler HV14 is RoHS compliant and is available for order now. Pricing is available upon request.
More information on the OptoCooler HV14 can be found at www.nextreme.com/optocooler. Contact Nextreme at 3908 Patriot Dr., Suite 140, Durham, NC 27703-8031; call (919)-597-7300; e-mail info@nextreme.com; or go to www.nextreme.com.
About Nextreme Thermal Solutions(TM), Inc.
Nextreme Thermal Solutions designs and manufactures microscale thermal and power management products for the electronics, telecommunications, semiconductor, consumer, and defense/aerospace industries. The company uses breakthrough thin-film thermoelectric material to embed cooling, temperature control and power generation capabilities into the widely accepted copper pillar bumping process used in high-volume electronic packaging. Nextreme's headquarters and manufacturing facility are based near Research Triangle Park, North Carolina.
For additional information or to request the electronic image, please email beth.gaddy@btbmarketing.com or call 919-872-8172.
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