Thermoelectric Assemblies increase cooling in enclosures.July 27, 2009 -
Suited for telecom battery back-up systems and electronic integration enclosures in harsh environments, AA-100/-150/-200 Air-to-Air Outdoor Thermoelectric Cooler Assemblies feature solid-state operation and do not use compressor or CFC refrigerants. Elements of construction include waterproof connectors, high-density heat sinks with heavy-duty anodization, and overheat protection as well as double environmental seals, fans, and custom thermoelectric modules.
(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)
Original Press release
Laird Technologies
16401 Swingley Ridge Rd., Suite 600
Chesterfield, MO, 63017
USA
Laird Technologies Introduces Newly Modified Air-to-Air Outdoor Thermoelectric Cooler Assemblies
Highly-Reliable Thermoelectric Assemblies Increase Cooling In Outdoor Enclosure Applications
St. Louis, Missouri, USA - July 22, 2009 - Laird Technologies, Inc., a global leader in the design and manufacture of customized, performance-critical components for wireless systems and other advanced electronics applications, today announced the introduction of its newly modified Air-to-Air Outdoor Thermoelectric Cooler Assemblies.
This series was modified to expand the number of outdoor applications, particularly telecom battery back-up systems and electronic integration enclosures that require cooling in harsh environments. Products in this series include the AA-100, AA-150, and AA-200.
Laird Technologies' outdoor thermoelectric cooler assembly product line incorporates custom designed thermoelectric modules with high coefficient of performance (COP) to minimize power consumption, brand name fans that have the highest degree of environmental protection and reliable solid-state operation that does not use a compressor or CFC refrigerants. They also offer waterproof connectors, high-density heat sinks with heavy duty anodization, overheat protection, and double environmental seals to protect against outside contaminants. The gaskets, connectors, and fans provide an enclosure seal that is rated NEMA 4. DC operation is available in either 24 or 48 VDC.
"Our Outdoor Air-to-Air Cooler Assemblies have passed rigorous Telcordia testing," said Andrew Dereka, Laird Technologies' Thermoelectric Product Manager. "This product series has gone through several design evolutions over the years with strategic partnerships obtained with leading telecom equipment manufacturers. As a result, these outdoor units have earned their reputation for reliability, efficiency, and low-cost maintenance of line."
Laird Technologies' Outdoor Thermoelectric Cooler Assemblies are ideal for outdoor applications in harsh environments such as telecom battery back-up systems, outdoor kiosks and displays, as well as electronic system integration enclosures.
About Laird Technologies, Inc.
Laird Technologies designs and manufactures customized, performance-critical products for wireless and other advanced electronics applications.
The company is a global market leader in the design and supply of electromagnetic interference (EMI) shielding, thermal management products, mechanical actuation systems, signal integrity components, and wireless antennae solutions, as well as radio frequency (RF) modules and systems.
Custom products are supplied to all sectors of the electronics industry including the handset, telecommunications, data transfer and information technology, automotive, aerospace, defense, consumer, medical, and industrial markets.
Laird Technologies, a unit of Laird PLC, employs over 10,000 employees in more than 39 facilities located in 13 countries.
Contact Information
For additional information, visit http://www.lairdtech.com or contact us at:
Americas: +1.888.246.9050 option 2
Asia: +86.755.2714.1166
Europe: +46.31.420530
e-mail: CLV-customerservice@lairdtech.com
Trademarks
© 2009 All rights reserved. Laird Technologies and its logo are trademarks of Laird Technologies, Inc. Other products, logos, and company names mentioned herein, may be trademarks of their respective owners.
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