September 26, 2012 -
Mixed in ratio of 1 part base resin to 1 part activator by weight, Aremco-Bond™ 860 exhibits optimal adhesion to high temperature plastics such as polyimides and composites, as well as ceramics, glass, and high expansion metals. Aluminum nitride filled epoxy cures in 24 hr at room temperature or in 2 hr at 200°F. After curing, product exhibits thermal conductivity of 8.5 Btu-in./hr-ft²-°F and dielectric strength of 250 V/mil. Epoxy is intended for electrical and electronic bonding applications.
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