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Thermally Conductive Adhesive suits electronics markets.

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December 19, 2008 - Silicone-based material, TC-2030, features thermal conductivity (2.7 W/mK) and elastomeric properties that lend to long-term reliability after aging. A/B system adheres to various substrates, including anodized or cast aluminum, tin-plated copper, and PCBs, and can be applied by dispenser after 2-part formulation is mixed. Areas of use include automotive electronics, LED assembly, and computers.

(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)
Original Press release

Dow Corning Corp.
2200 W. Salzburg Rd.
Midland, MI, 48686 0994
USA



Dow Corning Electronics Introduces New High-Performance DOW CORNING(R) TC-2030 Thermally Conductive Adhesive for Diverse Electronics Markets


New Silicone-Based Material Offers Outstanding Thermal Performance, Adhesion and Stability After Aging

MIDLAND, Mich., Dec. 9 -- Dow Corning Corporation's Electronics group today announced the worldwide availability of its DOW CORNING(R) TC-2030 A&B Thermally Conductive Adhesive for use in automotive electronics, LED assembly and in the computer market. TC-2030 offers outstanding thermal conductivity and excellent elastomeric properties after aging, providing long-term reliability. Good adhesion to various substrates, such as anodized or cast aluminum, tin-plated copper and printed circuit boards, make this material well suited for use across a wide variety of electronics markets.

TC-2030's thermal conductivity of 2.7 W/mK is higher than traditional thermally conductive adhesives. With a viscosity of 190 Pa.s, it also offers good dispensing characteristics and can be easily applied by a dispenser after the two-part formulation is mixed.

"The introduction of TC-2030 expands Dow Corning's line of thermally conductive adhesive products to meet a wider range of customer needs," said Rogier Reinders, Dow Corning's global automotive marketing leader. "Dow Corning has been using field-proven fillers to achieve new levels of loading, rheology and bondline control with a resulting step change increase in thermal performance and stability after aging. The electronics market has shown a need for improved heat dissipation in printed circuit board applications with high power components. Dow Corning's high thermal conductivity TC-2030 provides manufacturers with a viable option to address this need."

For more information on Dow Corning Electronics Group's full range of materials and services, visit http://www.dowcorning.com/content/etr....

About Dow Corning

Dow Corning (www.dowcorning.com) provides performance-enhancing solutions to serve the diverse needs of more than 25,000 customers worldwide. A global leader in silicones (http://www.dowcorning.com/content/discover), silicon-based technology and innovation, Dow Corning offers more than 7,000 products and services through the Dow Corning(R) and XIAMETER(R) brands (http://www.xiameter.com/main.asp). Dow Corning is a joint venture equally owned by The Dow Chemical Company (NYSE:DOW) and Corning, Incorporated (NYSE: GLW). More than half of Dow Corning's annual sales are outside the United States.


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