Thermal Interface Material features silicone-free design.
November 10, 2006 -
Suited for silicone sensitive applications, GORE(TM) POLARCHIP® SF3000 fills air gaps between heat generating devices on PCBs and heat sinks, heat spreaders, and metal chassis that are used to dissipate heat. Fluoropolymer composite consists of expanded polytetrafluoroethylene matrix filled with boron nitride particles. Absence of silicone eliminates problems of silicone outgassing and silicone oil migration. Material is produced in continuous rolls with pressure-sensitive adhesive on one side.
(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)
Original Press release
Gore, W. L., & Associates, Inc., Electronic Products Div.
402 Vieve's Way
Elkton, MD, 21922-0160
USA
Gore Introduces New Silicone-Free Thermal Interface Material
Elkton, Md. (October 2006) - W. L. Gore & Associates (Gore) is pleased to introduce a new capability to the GORE(TM) POLARCHIP® Thermal Interface Material family. GORE(TM) POLARCHIP® SF3000 Silicone-Free Thermal Interface Material is a truly soft silicone-free thermal gap pad. The absence of silicone eliminates the problems of silicone outgassing and silicone oil migration ("bleeding"), making GORE(TM) POLARCHIP® SF3000 Silicone-Free Thermal Interface Material the ideal gap pad for silicone sensitive applications.
This highly compressible, thermally conductive material is ideally suited for filling the undesirable air gaps between heat generating devices on printed circuit boards (PCBs) and the heat sinks, heat spreaders and metal chassis that are used to dissipate the heat. GORE(TM) POLARCHIP® Thermal Interface Material is a fluoropolymer composite that consists of an expanded polytetrafluoroethylene (ePTFE) matrix filled with boron nitride (BN) particles. The low elastic modulus of the ePTFE matrix imparts softness, conformability and excellent compressibility to the composite, while the high thermal conductivity of the BN particles gives the composite its good thermal transport characteristics. The reinforcing nature of the ePTFE matrix results in a composite that is physically robust, easy to handle and does not require additional reinforcement. GORE(TM) POLARCHIP® Thermal Interface Materials are produced in continuous rolls with a pressure sensitive adhesive on one side. It can be supplied in sheets or rolls of precision die-cut parts suitable for high volume automation assembly.
For more information, contact W. L. Gore & Associates at 800-445-4673, +1/302-292-5100, +49/91 44 6010, or visit their Web site at www.gore.com
Please send leads to:
Technical Marketing Support
W. L. Gore & Associates, Inc.
402 Vieve's Way
Elkton, MD 21921
(800) 445-4673
(TM)GORE and ®POLARCHIP are trademarks of W. L. Gore & Associates, Inc.
Copyright 2006 - W. L. Gore & Associates, Inc.
|
|
|
|
|
|
|
| 
