Thermal Gel Pads require no reinforcement.
July 29, 2003 - ThermaSoft self-supporting, silicone-gel pads contain no fiberglass cloth or polyurethane foam, allowing them to be compressed more than other gap-filling materials. Material wraps around components to improve heat transfer. ThermaSoft pads are available as die-cut parts and in standard sheet size of 8 x 8 in. with thickness from 0.5–7 mm. Thermal conductivity is 1.0 W/m-k and thermal impedance is 0.98 C/W/in (3mm thick at 20psi).
(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)
Original Press release
Orcus
Box 307
Stilwell, KS, 66085
USA
ThermaSoft, the Next Generation of Thermal Gel Pads
A PROBLEM YOU HAVE SURELY MET: Gap filling products consist of a fiberglass cloth substrate coated with Silicone gel, or they are polyurethane foam that is impregnated with Silicone gel. The reason for this is that the Silicone Gel material is not cohesive enough by itself and requires mechanical reinforcement. When you deform these products they initially conform easily to surface irregularities. However as you continue to deform them, the fiberglass cloth or polyurethane foam prevent further deformation. Increased pressure on the material no longer results in deformation. This means the ability of the pad to conform to surface features on a circuit board is severely limited. As one frustrated thermal designer expressed it: “It’s like running into a stone wall.”
WE FOUND A SOLUTION: ORCUS created ThermaSoft, the first self-supporting silicone gel pad that requires no reinforcement. Therefore it is eminently deformable. This means it can be compressed much more than other gap filling materials. The result is that ThermaSoft can wrap itself around components much better than other products, and that means better heat transfer. So, it fits both engineering and manufacturing requirements, allowing you efficient use.
ThermaSoft is available as die-cut parts and in standard sheet size of 8”x 8”. It can be supplied in thicknesses from 0.5mm to 7mm. Thermal conductivity of ThermaSoft is 1.0 W/m-k and thermal impedance is 0.98 C/W/in (3mm thick at 20psi). But these figures don’t tell the whole story. Since ThermaSoft can conform so much better to circuit board components, it achieves better heat transfer than other products.
Contact Information:
ORCUS, inc.
Contact: Sales
Telephone: 913-438-9976
Fax: 913-438-7180
Website: www.ORCUSinc.com
Email: info@ORCUSinc.com
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