Product News: Materials & Material Processing
Thermal Gap Fillers feature silicone-free design.
Press Release Summary:
December 12, 2012 - Offered in variety of thicknesses to suit virtually any need, Tflex™ SF800 features thermal conductivity of 7.9 W/mK, while Tflex™ SF200 offers thermal conductivity of 1.8 W/mK or 2.0 W/mK, depending on thickness. Silicone-free gap pads are naturally tacky on both sides and require no additional adhesive coating. In addition, SF200 is available with differential tack for assembly and rework. Applications include automotive, consumer products, medical devices, and laser equipment.
Original Press Release
Laird Technologies Releases Two New Tflex(TM) Series Products
Press release date: December 6, 2012
Products are High-Performance Silicone-Free Gap Fillers
St. Louis, Missouri, USA – Laird Technologies, Inc., a global leader in the design and supply of customized performance-critical components and systems for advanced electronics and wireless products, today announced the release of two new Tflex™ series thermal gap fillers.
The Tflex™ SF800 and Tflex™ SF200 are the latest addition to Laird Technologies’ thermal gap filler line. The introduction of these two new products expands Laird Technologies’ silicone-free gap pad selection. Tflex SF800 is a high performance gap pad with exceptional wetting characteristic, while Tflex SF200 features extremely low contact resistance for effective heat transfer. These products are naturally tacky on both sides and require no additional adhesive coating, allowing for exceptional thermal performance.
Both the Tflex SF800 and Tflex SF200 are offered in a variety of thicknesses to suit virtually any need. The SF800 has thermal conductivity of 7.9 W/mK, while the SF200 offers thermal conductivity of 1.8 W/mK or 2.0 W/mK, depending on thickness. These silicone-free gap pads are easy to handle in all available thicknesses while their natural tack allows for the pad to be held in place during assembly. Tflex SF200 is available with differential tack for easy assembly and rework.
“These new products are not only great solutions for silicone sensitive applications, but they are also effective in applications where silicone pads are traditionally used,” said Jane Lacy, Laird Technologies Product Manager. “They are ideal for a variety of applications including automotive, consumer products, medical devices and laser equipment.”
As an industry leader in high-performance and cost-effective Thermal Management Solutions, Laird Technologies provides the knowledge, innovation, and resources to ensure exceptional thermal performance and customer satisfaction for applications in the medical, analytical, telecom, industrial, and consumer markets.
For additional information, visit http://www.lairdtech.com or contact us at:
Americas: +1-888-246-9050 option 2
Asia: +86-755-2714-1166 x374
Translated versions of this press release are available in Simplified and Traditional Chinese, Japanese, Korean, and German languages.
About Laird Technologies, Inc.
Laird Technologies is a global technology company focused on providing components and solutions that protect electronic devices from electromagnetic interference and heat, and that enable connectivity through wireless applications and antenna systems.
Custom products are supplied to all sectors of the electronics industry including the handset, telecommunications, data transfer and information technology, automotive, aerospace, defense, consumer, medical, mining, railroad and industrial markets.
Laird Technologies, a unit of Laird PLC, employs over 9,000 employees in more than 46 facilities located in 16 countries.
© 2012 All rights reserved. Laird Technologies and its logo are trademarks of Laird Technologies, Inc. Other products, logos, and company names mentioned herein, may be trademarks of their respective owners.