Thermal Conductive Epoxy Adhesive cures at room temperature.
May 14, 2009 -
Exhibiting thermal conductivity and electrical insulation properties, EP21TCHT-1 offers service operating temperature range of 4 K to 400°F. It adheres to metals, ceramics, woods, vulcanized rubbers, and most plastics, and provides bonds resistant to water, fuels, and most organic solvents. NASA qualified for low outgassing applications, adhesive is suited for use in vacuum environments. Product has mix ratio of 100-60 by weight and light paste viscosity.
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|Original Press release |
Master Bond, Inc.
154 Hobart St.
Hackensack, NJ, 07601
Rigid, Room Temperature Curing Thermal Conductive Epoxy for Service up to 400°F
HACKENSACK, NJ - May 7, 2009 - In many challenging bonding applications, elevated temperature cures are not possible. In order to overcome this deficiency, Master Bond has made available new EP21TCHT-1. Curable at room temperatures, EP21TCHT-1 has high thermal conductivity and superior electrical insulation properties. It has a service operating temperature range of 4K to 400°F. It also has a remarkably low thermal expansion coefficient. EP21TCHT-1 is NASA qualified for low outgassing applications. It is highly recommended for use in vacuum environments.
Master Bond EP21TCHT-1 is durable and possesses high physical strength properties. Adhesion to metals, ceramics, woods, vulcanized rubbers and most plastics is excellent. Bonds are resistant to water, fuels and most organic solvents. EP21TCHT-1 has a mix ratio of 100 to 60 by weight. It has a light paste viscosity and is easy to apply.
MASTER BOND INC.
154 Hobart Street