Test System offers wafer-level device characterization.August 15, 2007 -
For measurement accuracy, ProbeShield® Technology prevents unwanted EMI/RFI and light from influencing measurements. It includes positioning system that can withstand forces from high-pin-count probe card, and optional MicroAlign(TM) Technology that automates probe-to-pad alignments. ContactView(TM) and ProbeHorizon(TM) assist operators in setting contact and mitigate risk of damaging wafers and probe cards, while automation of routine tasks minimizes error.
(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)
Original Press release
SUSS MicroTec Inc.
GITC 1-18-2, Hakusan
Yokohama, ,
Japan
SUSS MicroTec Unveils New ProbeShield® Technology
Advanced wafer-level device characterization and reliability test system shortens time to market and increases return on investment
MUNICH, Germany, July 17, 2007 - SUSS MicroTec AG, the world's premier supplier of wafer-level device characterization and reliability test systems for the semiconductor industry, today unveiled its new ProbeShield® Technology. Implementing unique design features, ProbeShield Technology significantly improves the way in which semiconductor devices are characterized and their reliability tested. The semiconductor device manufacturer thus benefits from quicker, more accurate measurement results, which means more efficient model extraction, faster model turnaround and fewer design iterations, reduced time to market and ultimately a higher return on investment.
The Need for Accuracy
Semiconductor device manufacturers face a challenging marketplace; consumers demand higher performance and better reliability from their electronic devices. To meet this challenge, new technologies are being developed using advanced and hybrid designs, new materials and innovative manufacturing processes. To realize a return on the investment in these technologies, device manufacturers must keep yield high and time to market short. This can only be achieved with efficient and highly accurate device characterization and reliability testing at wafer-level. ProbeShield Technology does this by enhancing the three areas important for any effective device characterization and reliability test system: Measurement Accuracy, Positioning Accuracy and Human Accuracy.
Excellent Measurement Accuracy
For best-in-class measurement accuracy, the new ProbeShield Technology has an advanced shield that prevents unwanted electromagnetic (EMI) and radio-frequency (RFI) interference as well as light from influencing measurements. In addition, the design of the light-tight, EMI/RFI shield allows measurement instruments to be integrated into the shielded environment of the system, protecting them as well as eliminating the need for additional shielded rooms.
Precise Positioning Accuracy
As the size of pads shrink and the number of probe tips grow, the importance of precise, repeatable and stable contact becomes a critical feature of the probe system. ProbeShield Technology features a high-precision positioning system that can withstand high forces from high-pin-count probe cards as well as optional MicroAlign(TM) Technology for automating probe-to-pad alignment, especially useful for vertical probe cards used to contact small pads.
Enhanced Human Accuracy
ProbeShield Technology places a great focus on human accuracy, the ergonomics, safety and intelligence of the system, especially with high turnover of operators and technicians and rising training costs. Useful tools like the patented ContactView(TM) and ProbeHorizon(TM) assist operators in setting contact and mitigate the risk of damaging expensive wafers and probe cards. Furthermore, intelligent systems like Automated Thermal Management(TM) and automation of routine tasks markedly reduce error and the need for constant operator intervention, optimizing the throughput and cost of ownership of ProbeShield Technology.
"Our main goal at SUSS is to make our customers' job of efficient and accurate device characterization and reliability test easier," said Dr. Stojan Kanev, Head of Marketing and Product Management for Test Systems at SUSS MicroTec. "We know that he or she does not want to waste time trying to configure a setup or re-measuring parameters in order to get the most accurate results, especially if the probe system is difficult and frustrating to use."
"We have designed our ProbeShield Technology to significantly improve the ease at which reliable, accurate measurement results can be obtained. I am convinced that device manufacturers will benefit from a higher return on investment and a shorter time to market as a result of the quick and accurate measurement results that can be extracted using a 300 or 200 mm system with new ProbeShield Technology."
For more information, please contact:
Joshua M. Preston, Marketing Group Manager, SUSS MicroTec Test Systems
Tel: +49 (0) 35240 73-0, E-Mail: info@suss.com
To view the entire press release on-line, please visit: http://suss.com/about_suss/latest_news/2007/17-07-2007
If you would like additional information on any of our products, please visit www.suss.com or reply to this email. Please include your full name, mailing address and contact information to receive brochures or technical articles. If, at any time, you would prefer not to receive SUSS News Alerts, please reply as such to this email and your address will be removed from our list.
For further correspondence send to:
SUSS MicroTec, Inc.
228 Suss Drive
Waterbury Center, VT 05677 U.S.A.
Attn: Electronic Marketing Dept.
Louise Jones
SUSS MicroTec Inc.
Sales & Marketing Specialist
ljones@suss.com
800-685-7877, Ext. 218
Visit us on the web at www.suss.com
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