Test Socket suits devices from 28-40 mm².
July 15, 2005 -
Measuring 3.507 x 2.750 x 1.759 in, RF Center Probe Test Socket offers manual testing of devices with pitches down to 0.50 mm, in applications with speeds from 1 GHz to over 18 GHz. Socket provides minimal signal loss via signal path of .077 in. Solderless, pressure-mount compression spring probes allow socket to be mounted to and removed from test board. Contact forces are 9-12 g per contact for 0.50-0.75 mm pitches and 17-20 g per contact for 0.80 mm pitches and larger.
(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)
Original Press release
Aries Electronics, Inc.
2609 Bartram Road
Bristol, PA, 19007-6810
USA
Aries Introduces New RF Center Probe Test Socket for Devices from 28 mm² to 40 mm²
Frenchtown, NJ, July 2005 - Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, has introduced a new high frequency test socket for devices from 28 mm² to 40 mm². The new socket is ideal for manual testing of devices with pitches down to 0.50 mm, in applications with speeds from 1 GHz to over 18 GHz, such as CSP, MicroBGA, DSP, LGA, SRAM, DRAM, and Flash devices.
The new RF socket provides minimal signal loss for higher bandwidth capability via a signal path of only .077" (1.95 mm). The socket's overall size of 3.507" (89.08 mm) x 2.750" (69.85 mm) x 1.759" (44.68 mm) provides the maximum allowable space for load board components and connectors.
Solderless, pressure-mount compression spring probes allow the socket to be easily mounted to and removed from the test board. These gold-over-nickel compression spring probes screws leave very small witness marks on the bottom of the device solder balls, and are accurately located by two molded plastic alignment pins and secured with four stainless steel screws.
The 4-point spring probe crown on the new socket ensures "scrub" on solder ball oxides for reliable contact mating, and the pointed probe works with LGAs, MLFs and other socket types.
The compression spring probes are heat-treated beryllium copper alloy, plated with 30 µ" min. (0.75 µm) gold per Mil-G-45204 over 30 µ" min. (0.75 µm) nickel per QQ-N-290. The socket's molded components are UL94V-0 PEEK and/or Ultem. All hardware is stainless steel.
Contact forces of the new center probe sockets are 9 g to 12 g per contact for 0.50 mm to 0.75 mm pitches, and 17 g to 20 g per contact for 0.80 mm pitches and larger. Operating temperature is -55°C to +150°C (-67°F to +302°F). Estimated contact life is over 500,000 cycles and contact self-inductance is 0.59 nH.
As with all Aries sockets, the new RF test socket is available in custom materials, platings, sizes and configurations to suit specific customer applications.
Pricing for a 100-lead socket starts at $599. Delivery is 4-6 weeks ARO.
For additional information, contact Aries Electronics, Inc., P.O. Box 130, Frenchtown, NJ 08825. Tel: 908/996-6841; Fax: 908/996-3891; E-mail: info@arieselec.com Web Site: www.arieselec.com, Data sheet #24012 http://www.arieselec.com/products/24012.pdf
Europe contact Tel: +44 870 240 0249; Email: europe@arieselec.com.
Headquartered in Frenchtown, NJ, Aries Electronics, Inc., manufactures an extremely broad range of custom and standard interconnection and packaging products for electronics. Industry leading products include Zero Insertion Force (ZIF) test sockets for DIP, PGA, PLCC and SOIC devices; the Correct-A-Chip(TM) product line of "intelligent connectors"; adapters and connectors; several patented concepts for BGA (ball grid array) and LGA (land grid array) sockets; and an extensive array of high frequency test and burn in sockets. The company also specializes in meeting custom requirements for its customers.
|
|
|
|
|
|
|
|
