Surface Mount Pin Header eliminates co-planarity problems.
September 14, 2010 -
Consisting of square posts press-fit into round plated through holes on header PCB, Surface Mount Pin Header optimizes retention force. Circular solder pad on top of board and square solder pad on bottom are connected to conductive plate of through hole. Size of hole is such that it holds square pin in place, yet leaves 4 cavities that promote capillary action by drawing up melted solder where it forms ring at top, indicating that reflow process is complete.
(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)
|Original Press release |
Zierick Manufacturing Corp.
Mount Kisco, NY, 10549
New Surface Mount Pin Headers from Zierick Offer 50% Higher Pin Retention Force than J-Lead Headers
Zierick Manufacturing Corporation introduces a new surface mount pin header. The header assembly consists of square posts press-fit into round plated through holes on a "header printed circuit board." A circular solder pad on top of the board and a square solder pad on the bottom are connected to the conductive plate of the through hole. The size of the hole is such that it holds the square pin in place, yet leaves four cavities defined by the flat side of the pin and the curved wall of the hole. The cavities promote capillary action by drawing up most of the melted solder through the cavities where it forms a ring at the top. This action pulls the header board assembly into proper position, even if it is placed off center on the PCB. Co-planarity problems are eliminated, and a much stronger solder joint produces 50% higher retention force than J-Lead headers. The solder ring formed at the top side of the header assembly board is a visual indication that the reflow process is complete.
To learn more, please use our contact form, call us at 800-882-8020 (in New York, 914-666-2911) or write Zierick Manufacturing Corporation, Radio Circle, Mt. Kisco, New York 10549, fax 914-666-0216.