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Sub-˝ Air Transport Rack Box provides convection and conduction cooling.

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Sub-˝ Air Transport Rack Box provides convection and conduction cooling.
Sub-˝ Air Transport Rack Box provides convection and conduction cooling.

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April 29, 2011 - Compliant with MIL-STD-810 standards, XPand5200 convection-cooled air transport rack (ATR) can serve in harsh environments and supports 3U cPCI and 3U VPX backplanes. Unit measures 10.30 x 4.88 x 5.65 in. and provides 4 conduction-cooled, 0.8 in. slots as well as up to 3 configurable D38999 front panel I/O connectors. Other features of this environmentally sealed unit include MIL-STD-704-compliant, 28 Vdc power supply; MIL-STD-461 E/F EMI filtering; and foldable front panel handle.

(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)
Original Press release

Extreme Engineering Solutions (X-ES)
3225 Deming Way
Middleton, WI, 53562
USA



X-ES Unveils Convection-Cooled Sub-˝ ATR Box for Rugged Military Applications


Middleton, WI - Extreme Engineering Solutions, Inc. (X-ES) announces the immediate availability of the XPand5200, a convection-cooled sub-˝ ATR box that provides both convection-cooling and conduction-cooling to conduction-cooled payload cards. Both 3U CompactPCI and 3U VPX backplanes are supported by the XPand5200. Meeting the rigorous MIL-STD-810 standards, the XPand5200 is a sub-˝ ATR solution for deployed systems in the harshest environments.

The XPand5200 features include:
  • ˝ ATR natural convection-cooled and conduction-cooled chassis (reduced height and length)
  • Four conduction-cooled 0.8-inch slots
  • Physical dimensions of 4.88 in. (W), 5.65 in. (H), 10.30 in. (L)
  • 3U VPX and cPCI backplanes available
  • Up to three D38999 front panel I/O connectors (configurable)
  • Integrated MIL-STD-704-compliant, 28V DC power supply
  • MIL-STD-461 E/F EMI filtering
  • Optional internal holdup of up to 100 ms at 70 W
  • Foldable front panel handle
  • Environmentally sealed
  • Integration services with third-party modules available

    The XPand5200 rounds out X-ES's sub-1/2 ATR systems for 3U conduction-cooled payload modules to provide customers with a full range of rugged systems deployed in harsh environments:
  • Conduction-cooled XPand3200: 4.88 in. (W), 5.62 in. (H), 8.75 in. (L)
  • Forced air-cooled XPand4200: 4.88 in (W), 6.0 in (H), 13.5 in (L)
  • Convection-cooled XPand5200: 4.88 in. (W), 5.65 in. (H), 10.30 in. (L)

    "We have seen demand for XPand5200-based systems as rugged Network Attached Storage (NAS) appliances; since solid state storage generates very little heat, it is well suited to natural convection-cooling," states Bret Farnum, VP Sales. "We can provide a total of 3.5 TB of solid state Network Attached Storage in our XPand5200 populated with an Intel or Freescale SBC."

    About X-ES - Extreme Engineering Solutions, Inc. (X-ES) designs and builds chassis, single-board computers, I/O, power, backplane, and system-level products within the embedded computer industry. X-ES offers cutting-edge performance and flexibility in design, plus an unparalleled level of customer support and service. For further information on X-ES products or services, please visit our website: www.xes-inc.com or call (608) 833-1155.

    Data Sheet: http://www.xes-inc.com/products/view/xpand5200/
    Press Photo: http://xes-inc.com/assets/photos/content/093621_XPand5200.jpg

    All trademarks are property of their respective owners.
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