Soldering Flux offers anti-slump characteristics.
December 1, 2004 - Colorless, no-clean P520 Flux leaves clear residue for cosmetic joint finish. Printed or dispensed solder paste deposits retain shape through reflow cycle without slumping or bridging, making flux suited for fine pitch, no-clean electronic and electro-mechanical soldering applications. Flux is environmentally safe and exceeds IPC Joint Industry Standards J-STD-004A.
(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)
Original Press release
EFD Inc., Solder Paste Group
14 Blackstone Valley Pl.
Lincoln, RI, 02865
USA
EFD Announces A Breakthrough - Colorless No-Clean Flux With Anti-Slump Characteristics
Lincoln, RI USA -- The EFD Solder Paste Group has introduced a new colorless no-clean flux for use in their PrintPlus® and SolderPlus® solder paste product lines.
These new series leave a totally clear residue for a perfect cosmetic joint finish. In addition, with this flux system, printed or dispensed solder paste deposits retain shape through the reflow cycle without slumping or bridging, making this flux the ideal choice for fine pitch, no-clean electronic and electro-mechanical soldering applications.
The use of synthetic resin eliminates the dark amber residue discoloration common with other natural rosin-based fluxes and contributes to the exceptional anti-slump characteristics.
The new P520 flux series is available in PrintPlus® printing paste and the D540 series is used in SolderPlus® dispensing formulations. Both support EFD’s full range of lead-free and tin/lead solder paste alloys. This flux is environmentally safe and exceeds the IPC Joint Industry Standards J-STD-004A.
For further information and application assistance, please call 1-800-338-4353 or email solder@efd-inc.com.
|
|
|
|
|
|
|
| 
