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Solderability Test Equipment can conduct 6 separate tests.

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February 12, 2008 - ShareGen SPA 1000 Solder Paste Analyzer provides testing capabilities to help control and manage solder paste in production process. It can perform up to 6 separate tests in accordance to IEC 61189-5 and IPC-TM-650 standards and can also conduct solder paste Open Time tests. Capabilities minimize range of defects - missing components, tombstoning, component misalignment, non-wetting - to reduce inspection and rework time.

(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)
Original Press release

Ascentech
127 Goose Hill Rd.
Chester, CT, 06412
USA



Ascentech to Introduce Solderpaste Analyzer, Solderability Test Equipment at APEX


Chester, Connecticut, USA - Ascentech, LLC, North American distributor for the GEN3 Systems Ltd. products, will introduce new solderability test equipment at IPC/APEX in Booth #241 (Gen3-Ascentech). The premier new product is the ShareGen SPA 1000 Solderpaste Analyzer, which provides fast and accurate testing to help control and manage solder paste in the production process. It helps reduce a range of defects including missing components, tombstoning, component misalignment, non-wetting etc., thus greatly reducing inspection and rework time and cost, thereby increasing profit.

The SPA 1000 Solder Paste Analyzer is a unique 6-in-1 solder paste test system that can perform up to six separate tests that would previously have been performed by separate instruments, in accordance to IEC 61189-5 and IPC-TM-650 standards. It represents a unique "All-in-One" test system. The system can also be used to conduct solder paste "Open Time" testing. Additional application information and system specifications are available; visit www.ascentechllc.com.

Ascentech will also exhibit the MUST III Solderability Tester, a wetting balance testing system capable of testing to all relevant solder standards including ICE, MIL-STD, IPO/EYE/JADE, etc. The MUST System 3 measures the solderability of a printed circuit board and/or component's metallic terminations by documenting the wetting curve of the unit under test. The MUST System 3 is appropriate for testing all devices including multi-leaded components as well as SMT and BGA devices.

Ascentech will also exhibit CM-Series Ionic Contamination Testers.

Ascentech, LLC managing members Randy Allinson and Gregory Alexander formed the company in 2000 to provide products to enhance productivity, quality and reliability to the electronic assembly and PCB fabrication industries. To learn more about the company visit www.ascentechllc.com. For sales and technical information, contact Randy Allinson, Ascentech LLC, 127 Goose Hill Rd., Chester, CT, 06412: Tel 860-526-8903, e-mail rallinson@snet.net.
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