Solder Wire is comprised of high-purity materials.
July 23, 2004 -
Die Attach Solder Wire is manufactured from minimum of 99.9% pure materials with controlled oxide levels to facilitate wetting. It can be made to specific process or piece of equipment using advanced processes to hold to crucial diameters and tolerances for proper volume deposits. Standard packaging is available in 30-40 m spools; however custom spooling is available.
(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)
|Original Press release |
34 Robinson Rd.
Clinton, NY, 13323
Indium Corporation Introduces Die Attach Solder Wire
Indium Corporation's Die Attach Solder Wire is manufactured from high purity (a minimum of 99.9% pure) materials with controlled oxide levels to enhance wetting performance. This superior product is backed up by Indium Corporation's internationally-experienced engineers. They are knowledgeable in all facets of Material Science as it applies to the electronics and semiconductor sectors.
Indium's Die Attach Solder Wire can be manufactured to a specific process or piece of equipment using advanced processes to hold to crucial diameters and tolerances for proper volume deposits. Standard packaging is available in 30-40 meter spools; however custom spooling is also available.
Indium Corporation is a three-time Frost & Sullivan Award-winning supplier of electronics assembly materials, including solder pastes, solder preforms, fluxes, Pb-Free solder alloys, underfill materials, die-attach materials, and more. The company is also the world's premiere supplier of commercial grade and high-purity indium. Factories are located in North America, Europe, and Asia. Founded in 1934, the company is ISO 9001 registered.
For more information about Die Attach Solder Wire, visit Indium Corporation at www.indium.com or email AskUs@indium.com.