Solder Paste suits multiple-step component assembly.
September 16, 2005 -
High-temperature, lead-free Type SN89/SB10.5/CU0.5 features solidus temperature of 242°C, 22°C delta above SAC. It exhibits tensile strength of 12,000 psi and has pasty range of 21°C from 263-242°C, which minimizes tombstoning. Available in all flux systems and alloy types II, III, IV, and V, dispensing and printing paste is suited for multi-step assembly where component will later be attached to PCB using SAC alloy.
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Original Press release
EFD Inc.
977 Waterman Ave.
East Providence, RI, 02914-1342
USA
New High-Temperature Lead-free Solder Paste
EFD introduces SN89/SB10.5/CU0.5 a new high-temperature lead-free solder paste formulation with a solidus temperature of 242ºC, 22°C delta above SAC. This alloy may be used for multiple-step component assembly where the component will later be attached to a PCB using SAC alloy.
With the deadline for lead-free rapidly approaching, an alloy with a higher reflow temperature is necessary. Additional advantages of the new high-temp lead-free solder paste are that it exhibits extremely high tensile strength (~12,000 PSI), improved wetting properties compared to other lead-free alloys, and has a pasty range of 21ºC from 263ºC to 242ºC, which reduces tombstoning.
This new dispensing and printing paste is available in all flux systems and alloy types II, III, IV, and V. For more information or to request an evaluation sample, contact an EFD solder paste specialist at 1-800-338-4353, or visit their web site at: www.efdsolder.com, a comprehensive source for soldering process innovations.
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