Solder Paste Printer comes with touch panel interface.
March 29, 2010 -
Offered with optional high speed print head and cleaning unit, SI-P850 delivers sustained sub 20 sec print cycles even on assemblies with 0201 and smaller chips. It offers high-precision printing of +20 µm and 0.3 mm fine pitch. Automatic paste dispense option provides accurate paste volume control and reduces waste. Enabling fast change overs, unit also offers automatic stencil cleaning with roll paper or cloth cleaning of targeted areas of stencil.
(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)
Original Press release
Sony Manufacturing Systems America, Inc.
20381 Hermana Circle
Lake Forest, CA, 92630
USA
SI-P850 Solder Paste Printer
Sony introduces the 0.3mm fine-pitch printing of SI-P850 Solder Paste Printer. The unit supports a wide range of stencils including the popular 29" square stencils.
o New literature arriving soon!
o High speed printing is possible with the optional high speed print head and high speed cleaning unit. Sustained sub-20 second print cycles are possible even on assemblies with 0201 and smaller chips.
o Fast change over is easy to accomplish
o High-Precision Reliable Printing: +20 µm and 0.3 mm fine pitch
o Automatic Stencil Cleaning with Roll Paper or Cloth cleaning of targeted areas of the stencil
o User Friendly Touch Panel Interface for Easy Operation
o Automatic paste dispense option provides rock solid paste volume control and reduces waste by more than 40%!
o New literature arriving soon!
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