Software accelerates semiconductor thermal characterization.
April 15, 2008 -
ThermPaq automates process for generating accurate semiconductor package models and computing complete set of JEDEC-compatible thermal characterization data. Built upon FLOPACK SmartPart technology and FLOTHERM CFD solver, this Web-based tool is entirely wizard-driven. It can interface with Cadence APD and also serves as design tool for thermal specialists. Package sub-elements are stored as separate libraries, facilitating use of data from third-party vendors.
(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)
Original Press release
Flomerics Inc.
4 Mount Royal Ave.
Marlborough, MA, 01752
USA
Thermpaq from Flomerics Accelerates Thermal Characterization of Semiconductor Packages
(April 10, 2008) -- Flomerics has released a unique new software product, ThermPaq, that revolutionizes the process of semiconductor thermal characterization and design. ThermPaq provides a fast, simple, proven, automated process that reduces the number of distinct steps required to be performed by thermal experts, reducing the risk of modeling errors to enhance the quality, reliability, and availability of package thermal models.
ThermPaq is built upon Flomerics' FLOPACK SmartPart technology and FLOTHERM's CFD solver. The web-based tool is entirely wizard-driven which makes it attractive for engineers who are not thermal specialists. The result is a fully automated process for generating accurate package models and computing the complete set of JEDEC-compatible thermal characterization data. These include all Theta and Psi metrics under various environmental conditions and industry-standard compact thermal models . Interfacing with Cadence APD, ThermPaq can take advantage of existing BGA layouts to capture metallization and via placement detail.
ThermPaq also serves as a powerful design tool for thermal specialists. Changes in thermal performance can be investigated through parametric variation of key package parameters to optimize the package thermal design. A comprehensive search function on all key package parameters and metric values allows the user to optimize the starting point for a new design. Package sub-elements such as substrates and leadframes are stored as separate libraries, facilitating the use of data from third-party vendors. Direct interfaces to semiconductor manufacturer packaging databases can also be created with minimal customization.
All this adds up to a huge productivity boost for semiconductor package characterization and design compared to existing approaches. Commenting on the new product, Sarang Shidore Director of Web Products at Flomerics Inc. said "ThermPaq is a quantum leap in Flomerics' offerings to the semiconductor industry. In creating this product our focus has been on one thing - to deliver even higher productivity. ThermPaq would not have happened without the critical feedback we have received from our customers over the past several years. We thank them for their support."
About Flomerics
Flomerics is a world-leading developer of engineering simulation software and services for analysis of fluid flow, heat transfer and electromagnetic radiation. Flomerics' business model, called "Design-Class Analysis" is drastically different from traditional analysis because its software is designed to be embedded deeply into the design process and used by mainstream design engineers, not just by analysis specialists.
For further information contact Sarang Shidore at +1 (512) 420 9273 or visit www.thermpaq.com.
Thermpaq is a trademark or trade name of Flomerics Ltd. All other products mentioned are trademarks or trade names of their respective companies.
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