ThomasNet Home   |   Promote Your Business
Home  |   My ThomasNet News®  |   Industry Market Trends  |   Submit Release  |   Advertise  |   About Us Feb 13, 2012  

Soft Gap Filler suits thermal interface applications.

Print | 
Email |  Comment   Share  
August 8, 2008 - T-flex(TM) 700, with 5.0 W/mK thermal conductivity and shore OO hardness value of 50, exhibits high compliancy that accommodates applications with high tolerance stack-up and low mechanical stress on components. Available in standard sheets or die cut parts that can be customized, soft gap filler has 0.040-0.200 in. thickness range in 0.010 in. increments. RoHS compliant product targets mechanical design engineers working on wide range of electronic devices.

(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)
Original Press release

Laird Technologies
16401 Swingley Ridge Rd., Suite 600
Chesterfield, MO, 63017
USA



Laird Technologies Introduces T- Flex 700 Series Thermally Conductive Gap Filler


5.0 W/mK soft gap filler is ideal for thermal interface applications where
high compliancy is desirable.

St. Louis, Missouri, USA - July 28, 2008 - Laird Technologies, Inc., a global leader in the design and supply of customized performance-critical components and systems for advanced electronics and wireless products, today announced the launch of its T-flex(TM) 700 for use as a thermal interface material (TIM).

The T-flex(TM) 700 is the next generation thermal pad in the T-flex(TM) gap filler line. It improves the thermal performance of the T-flex(TM) line by increasing the thermal conductivity to 5.0 W/mK. The soft material is highly compliant, allowing for thinner interfaces and overall improved thermal performance as measured by total thermal resistance. High compliancy accommodates applications where the tolerance stack-up is high and the maximum mechanical stress on the components must be low. A low shore OO hardness value of 50 helps maintain device reliability when mechanical shock and vibration are important design considerations. The T-flex(TM) 700 is naturally adhesive for ease of handling and assembly.

The T-flex(TM) 700 thermal material is available worldwide through Laird Technologies' sales and manufacturing locations. Thickness ranges currently available include 0.040 - 0.200 inch (1mm - 5mm) in 0.010-inch (0.25mm) increments. The product is available in standard sheets or die cut parts that can be custom made to specification. Another available option is adhesive on only one side. The T-flex(TM) 700 material will be extended as thin as 0.020-inch (.5mm) by the end of 2008.

The T-flex(TM) 700 is a high-performance solution available to mechanical design engineers working on a wide range of electronic devices including notebook and desktop computers, servers, wireless base stations and radio heads, laptops, LED lighting, set top boxes, LCD and PDP televisions, automotive electronics, and general applications employing heat pipes, heat sinks or thermal modules.

The T-flex(TM) 700 gap filler thermal interface materials meet the requirements of the RoHS Directive 2002/95/EC issued January 2003 and new standards for low BDA and PFOS. The new material has even lower concentrations of banned substances as required by leading OEM customers.

About Laird Technologies, Inc.
Laird Technologies designs and supplies customized, performance-critical products for wireless and other advanced electronics applications. The company is a global market leader in the design and supply of electromagnetic interference (EMI) shielding, thermal management products, mechanical actuation systems, signal integrity components, and wireless antennae solutions, as well as radio frequency (RF) modules and systems.

Custom products are supplied to all sectors of the electronics industry including the handset, telecommunications, data transfer and information technology, automotive, aerospace, defense, consumer, medical, and industrial markets.

Laird Technologies, a unit of Laird PLC, employs over 14,000 employees in more than 40 facilities located in 14 countries.

For additional information or your nearest representative, contact:
Tel: (866) 928-8181 or (636) 898-6000
Fax: (636) 898-6100
e-mail: sales@lairdtech.com

For more information, contact:
Ellie Rovai
Marketing Director (MarCom)
Tel: 636-898-6208
ellie.rovai@lairdtech.com

Internet: www.lairdtech.com
Print | 
Email |  Comment   Share  
Contacts: View detailed contact information.


 

Post a comment about this story

Name:
E-mail:
(your e-mail address will not be posted)
Comment title:
Comment:
To submit comment, enter the security code shown below and press 'Post Comment'.
 



 See related product stories
More .....
 Newsletters
Industry Market Trends
Has Got It
  • Latest developments
  • Trends
  • Best practices
  • Opinions & Commentary
Get Ahead. Get IMT.
Subscribe Free Today
Subscribe   View Sample

Your Gateway to a Fast Changing World
Product News Alerts
Receive similar stories and other customized news to keep you in the know on the products shaping industry.
Subscribe Free Today
Subscribe   View Sample
 See more product news in:
Materials and Material Processing
 More New Product News from this company:
Wireless Gateway supports M2M communications.
Liquid Cooling Systems suit densely packed electronic environments.
Wireless Module is used for industrial RF communication.
Radio Remote Control suits industrial rail applications.
UHF Antenna is designed for 2-way public safety radios.
More ....
 Other News from this company:
Laird Technologies Adds Thermoelectric Assembly Product Line to Digi-Key's Product Training Modules® Series
Laird Technologies Publishes EMI Microwave Absorber Application Note
Laird Technologies to Attend the 2012 International CES
Laird Technologies Publishes RF Chip Inductor Application Note
U.S. Patent Assigned to Laird Technologies Telematics & Wireless M2M Inventors
More ....
 Tools for you
Watch Company 
View Company Profile
Company web site
More news from this company
E-Mail Story
Save Story
Search for suppliers of
Thermal Interface Materials


Home  |  My ThomasNet News®  |  Industry Market Trends  |  Submit Release  |  Advertise  |  Contact News  |  About Us
Brought to you by Thomasnet.com        Browse ThomasNet Directory

Copyright © 2012 Thomas Publishing Company
Terms of Use - Privacy Policy