Soft Gap-Filler Materials provide thermal management.February 8, 2007 -
Suited for electronic devices, THERM-A-GAP(TM) 569 and 579 come in pre-formed thicknesses from 0.020-0.2 in. as well as custom thicknesses. With thermal conductivity of 3 W/mK, RoHS-compliant materials are rated UL-V0 for flammability and pass NASA outgassing. They are available on aluminum foil or clean-break glass fiber carrier. Typical applications include desktop and laptop computers, servers, telecommunications equipment, cellular handsets, and memory modules.
(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)
Original Press release
Chomerics, Div. Of Parker Hannifin Corp.
77 Dragon Court
Woburn, MA, 01888-4014
USA
Parker Chomerics Introduces Soft Gap-Filler Materials for Thermal Management of Electronic Devices
WOBURN, MA, January 31, 2007 - Chomerics, a division of Parker Hannifin Corporation (NYSE: PH), announced the introduction of THERM-A-GAP(TM) 569 and 579 ultra-soft thermal gap filler materials. 569 and 579 have the same high thermal performance as the 570 and 580 line of gap filler materials, but with increased conformability.
According to Product Manager Jonathan Bergin, "These products were developed to meet increasing customer demand for extreme conformability. THERM-A-GAP(TM) 569 is extremely soft, conformable, and cost-effective. 579 offers excellent conformability and thermal performance at competitive prices. In addition to pre-formed thicknesses from 0.020 to 0.2 inches, Chomerics offers custom thicknesses and molded solutions to meet our customers' needs for design flexibility.
In the 3 W/m-K thermal conductivity range, 579 is the softest material available in the market. Both materials pass NASA outgassing (UL E595), rated UL-V0 for flammability, and are RoHs compliant. All four products are available on aluminum foil (A) or on "clean break" glass (G) fiber carrier. As with all previous Chomerics gap-fillers, the "A" versions have a high strength acrylic pressure sensitive adhesive for permanent attachment to cold surfaces. Typical applications include desktop
and laptop computers, servers, telecommunications equipment, cellular handsets, consumer and automotive electronics, memory modules and vibration dampening in motors and engine controllers.
For complete details and specifications visit
http://www.chomerics.com/products/the...
CHOMERICS offers a free Thermal Materials Selector Guide available at http://www.chomerics.com/products/thermal.htm
With annual sales exceeding $9 billion, Parker Hannifin is the world's leading diversified manufacturer of motion and control technologies and systems, providing precision-engineered solutions for a wide variety of commercial, mobile, industrial and aerospace markets. The company employs more than 57,000 people in 43 countries around the world. Parker has increased its annual dividends paid to shareholders for 50 consecutive years, among the top five longest-running dividend-increase records in the S&P 500 index. For more information, visit the company's web site at http://www.parker.com, or its investor information site at http://www.phstock.com.
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