Silicone-Free Thermal Gap Filler requires minimal pressure.October 21, 2010 -
Available in thicknesses from 0.010-0.060 in. in 0.010 in. increments, Tflex(TM) SF600 DF compliant, silicone-free elastomer gap filler provides moderate thermal performance with conductivity from 2.8-3.0 W/mK. Soft interface pad conforms with minimal pressure, resulting in minimal thermal resistance even at low pressure with little or no stress on mating parts. One side of pad features differential tack, and other side is dry to touch, facilitating assembly.
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Original Press release
Laird Technologies
16401 Swingley Ridge Rd., Suite 600
Chesterfield, MO, 63017
USA
Laird Technologies Releases New Tflex(TM) SF600 DF Silicone-Free Thermal Gap Filler
Gap Filler Specifically Designed for Silicone-Sensitive Applications
St. Louis, Missouri, USA - Laird Technologies, Inc., a global leader in the design and supply of customized performance-critical components and systems for advanced electronics and wireless products, today announced the release of its new Tflex(TM) SF600 DF silicone-free thermal gap filler.
The Tflex(TM) SF600 DF is the most recent addition to Laird Technologies' Tflex(TM) thermal gap filler line. The pad offers a compliant, silicone-free elastomer gap filler specifically designed to provide moderate thermal performance with a thermal conductivity of 2.8 W/mK to 3.0 W/mK.
Available in thicknesses from 0.010 inch (0.25 mm) through 0.060 inch (1.5 mm) in 0.010 inch increments, this soft interface pad conforms with minimal pressure, resulting in minimal thermal resistance even at low pressure with little or no stress on mating parts. It also includes differential tack on one side and is dry to the touch on the other side, making for easy assembly.
The Tflex(TM) SF600 DF passes "cleanliness" testing requirements and is rated for International Disk Drive Equipment and Manufacturing Association (IDEMA) M11-99, M7-98, M12-99, and M13-99 standards. The gap filler pad is RoHS compliant and is certified to UL 94V0 flammability rating.
"The Tflex(TM) SF600 DF is a high performance, silicone-free thermal gap filler specifically designed for silicone-sensitive applications such as fiber optics, automotive modules, plasma display panels, and hard disk drives (HDDs)," said Jane Bell, Laird Technologies Thermal Interface Materials Product Manager.
As an industry leader in high-performance and cost-effective Thermal Management Solutions, Laird Technologies provides the knowledge, innovation, and resources to ensure exceptional thermal performance and customer satisfaction for applications in the medical, analytical, telecom, industrial, and consumer markets. For more information, please logon to www.lairdtech.com.
About Laird Technologies, Inc.
Laird Technologies designs and manufactures customized, performance-critical products for wireless and other advanced electronics applications. The company is a global market leader in the design and supply of electromagnetic interference (EMI) shielding, thermal management products, specialty metal products, signal integrity components, and wireless antenna solutions, as well as radio frequency (RF) modules and systems.
Custom products are supplied to all sectors of the electronics industry including the handset, telecommunications, data transfer and information technology, automotive, aerospace, defense, consumer, medical, and industrial markets.
Laird Technologies, a unit of Laird PLC, employs over 10,000 employees in more than 39 facilities located in 13 countries.
Contact Information
For additional information, visit http://www.lairdtech.com or contact us at:
Americas: +1-888-246-9050 option 2 or CLV-customerservice@lairdtech.com
Europe: +49-(0)-8031-2460-0 or TIM-EUSales@lairdtech.com
Asia: +86-755-2714-1166 x374 or Thermal-ChinaSales@lairdtech.com
Translations
Translated versions of this press release are available in Simplified and Traditional Chinese, Japanese, Korean, and German languages.
Trademarks
© 2010 All rights reserved. Laird Technologies and its logo are trademarks of Laird Technologies, Inc. Other products, logos, and company names mentioned herein, may be trademarks of their respective owners.
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