Self-Adhesive Parts join miniature assembly components.July 10, 2009 -
Measuring 4 x 4 mm, Mini-DSAPs are miniature, double-sided adhesive parts designed to join extremely small parts to other miniature assembly components. Products offer alternative to conventional bonding and joining techniques such as gluing, bolting, soldering, or ultrasonic welding. Offering instantaneous adhesion with very low maintenance, Mini-DSAPs require no curing, eliminating need for additional equipment such as drying ovens.
(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)
Original Press release
Schreiner ProTech, a business unit of Schreiner Group LP
300 Corporate Dr, Suite 10
Blauvelt, NY, 10913
USA
Schreiner ProTech Unveils Innovative Miniaturized Labeling Solutions for Very Small Assembly Components
Schreiner ProTech's Miniature Double-Sided Self-Adhesive Die-Cut Parts Offer a Clever Connection with Clear-Cut Benefits
SOUTHFIELD, Mich., June 30 /-- Schreiner ProTech today announced the introduction of its miniature double-sided adhesive parts (Mini-DSAPs), especially designed for very small assembly components. Miniaturized labeling solutions (4x4 millimeters), the Mini-DSAPs provide an alternative to conventional bonding and joining techniques like liquid gluing, bolting, soldering or ultrasonic welding.
Conventional methods quickly reach their limits when it comes to attaching miniaturized components to other very small components, like printed circuit boards. With the Mini-DSAPs, Schreiner ProTech offers a new, highly-reliable solution to join extremely small parts to any other miniature assembly components.
Unlike liquid adhesives, the Mini-DSAPs offer instantaneous adhesion with very low maintenance. While liquid adhesives are applied to the substrate by dispensers with nozzles that need to be regularly cleaned up, the Mini-DSAPs can be easily processed manually or by means of efficient automatic insertion equipment which precisely positions the Mini-DSAPs and accelerates the manufacturing process. Additionally, the Mini-DSAPs' bond requires no curing, eliminating the need for additional equipment like drying ovens or lines and saving production costs while speeding up the assembly process.
The Mini-DSAPs are tailored to meet the customer's specifications and ensure efficient, fast and clean handling, depending on the bonding substrate and application requirements. If needed, Schreiner ProTech can also deliver Mini-DSAPs with extra value-added functionalities. The joining elements can be available with specific thermal conductivity properties for use in electronic components requiring dissipation of the heat they generate.
As the steady trend toward miniaturization continues to reduce assembly components to smaller dimensions, Schreiner ProTech's customizable Mini-DSAPs provide manufacturers with a highly-reliable, cost-effective labeling solution ideal for such applications.
About Schreiner ProTech
As a certified systems supplier and development partner, the Schreiner High-Tech Group of Companies designs intelligent solutions in seven specialized divisions. Schreiner ProTech's objective of "making industrial labeling and manufacturing processes more efficient and leaner" is pursued through the development of innovative, increasingly intelligent functional films for engineering industries.
+SCHREINER PROTECH NORTH AMERICA, INC., A division of Schreiner Group GmbH & Co. KG, Steven Pasbjerg, Officer and Director Sales, +1-248-355-3006, Toll free, 888-888-8564, pasbjerg@schreiner-protech-na.com
Web Site: http://schreiner-protech.com/
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