Screen Printed Ink Material for PCBs facilitates electroplating.
April 6, 2010 -
Removable conductive silver plating link, CB500, is typically applied by screen or stencil printing via manual/automated equipment. Composition compliments traditional PCB manufacturing processes by enabling use of additive processing to rigid and flexible substrates. In addition to eliminating need for copper bus bars and other plating connections, product reduces or eliminates need for front, back, and side etching resist. It also reduces forming of unintended copper bump antennae.
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Original Press release
DuPont Microcircuit Materials
14 W. Alexander Dr.
Research Triangle Park, NC, 27709
USA
DuPont Microcircuit Materials Introduces New Screen Printed Ink Materials for Printed Circuit Boards
Expands CB Series Offering with CB500 removable conductive silver plating link
RESEARCH TRIANGLE PARK, N.C. - DuPont Microcircuit Materials (MCM) is expanding its CB Series of screen printed ink materials for printed circuit boards (PCBs) with the introduction of new DuPont CB500 removable conductive silver plating link - a printed silver conductor ink designed to simplify selective electroplating applications. DuPont CB Series compositions compliment traditional PCB manufacturing processes by enabling the use of additive processing to rigid and flexible substrates, and are typically applied by screen or stencil printing, using manual or automated screen printing equipment.
"DuPont CB500 provides the 'missing link' in the evolution of selective electroplating that can cut the number of process steps in half," said Walt Cheng, global business director -- DuPont Microcircuit Materials. "CB500 also can have a significant positive impact on productivity, yield, and ultimately the cost of the overall process to help fabricators more successfully reduce total cost of ownership. As a leading global supplier of printable inks and pastes to the electronics industry, MCM looks forward to continuing to expand its CB Series portfolio for the growing PCB market."
DuPont CB500 removable conductive silver plating link eliminates the need for copper bus bars or other plating connections, and is easily removed during the resist stripping step. It reduces the chance of forming unintended copper bump antennae caused by copper residue on the board, and reduces or eliminates the need for front, back and side etching resist. Ultimately, CB500 reduces process costs for PCB fabricators, saves space on the board, and allows fabricators to do selective rework on boards which can reduce the number of scrapped boards, improving yields.
DuPont MCM plans to continue to expand the CB Series with future developments, including a plateable silver conductor composition that can be used as cap for non-conductive via fill, with strong adhesion and increased bond strength to epoxy-based, non-conductive via fill materials on a variety of printed circuit board resin systems.
By connecting science and technology from across the company and around the world, DuPont continues to deliver advanced material solutions for the PCB industry. The DuPont CB Series offerings were recently highlighted at the CPCA show in Shanghai, China, and will be featured as part of a broad and growing portfolio of innovations in circuit materials at the IPC APEX Conference & Exhibition at Mandalay Bay in Las Vegas, Nev., from April 6 - 8, 2010. Other new technologies on display will include Riston® dry film photoresists and Idealine(TM) phototooling films for PCB imaging, Pyralux® flexible laminate materials and embedded resistor materials for PCB fabrication. To learn more about the products DuPont will be featuring for the PCB industry at the IPC APEX Expo this year, please visit us at the show in booth #616, or visit http://electronics.dupont.com/ipc for further details.
DuPont Microcircuit Materials has over 40 years of experience in the development, manufacture, sale, and support of specialized thick film compositions for a wide variety of electronic applications in the photovoltaic, automotive, biomedical, industrial, military and telecommunications markets. For more information about CB Series screen printed ink materials for printed circuit boards, contact DuPont Microcircuit Materials at 800-284-3382, or visit http://mcm.dupont.com.
DuPont is a science-based products and services company. Founded in 1802, DuPont puts science to work by creating sustainable solutions essential to a better, safer, healthier life for people everywhere. Operating in more than 70 countries, DuPont offers a wide range of innovative products and services for markets including agriculture and food; building and construction; communications; and transportation.
The DuPont Oval Logo, DuPont(TM), The miracles of science(TM), Pyralux® and Riston® are registered trademarks or trademarks of DuPont or its affiliates.
Idealine(TM) is a trademark or registered trademark of Agfa-Gevaert Group.
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