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Scanning Electron Microscope delivers high definition imaging.

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December 24, 2013 - Intended for material and life sciences applications, EVO Series delivers workflow automation, reducing typical workflow from over 400 steps to just 15. Workflow productivity is also improved by automated image settings such as beam alignment, magnification, and focus. Mid-column click-stop aperture changer ensures reproducible results, while beam deceleration technology and high definition BSE detector provide images rich in topographical information.
 
Original Press Release

Zeiss, Carl, Industrial Measuring Technology (IMT) Corp.
6250 Sycamore Lane N.
Maple Grove, MN, 55369
USA





Next Generation EVO Delivers Workflow Automation and High Definition Imaging


Advances to the Scanning Electron Microscope ZEISS EVO presented at Microscopy and Microanalysis 2013 Meeting

Jena/GERMANY and Cambridge/UK
At M&M 2013, Indianapolis, ZEISS launched the next generation EVO series for material and life science applications. Customer productivity and imaging performance are dramatically increased by the SEM’s workflow automation, beam deceleration technology and class leading HD BSE detector.

EVO reduces a typical workflow from over 400 steps to just 15.  Workflow productivity is improved by automated image settings such as the beam alignment, magnification and focus, allowing the imaging of areas of interest in the shortest possible time. A user-friendly mid-column click-stop aperture changer is introduced for reliable and reproducible results.

EVO allows imaging of exceptionally fine surface details with crisp contrast. Beam deceleration technology and a high definition BSE detector provide images rich in topographical information. When combined with EVO HD beam source technology, this ZEISS system sets a new standard in image quality from conventional scanning electron microscopes. 

Allister McBride, Director at ZEISS in Cambridge explains, “The customer benefits of the new EVO series are two-fold. Automation and Intelligent Imaging provide increased productivity and intuitive workflows; whilst beam deceleration and the HD BSE detector offer outstanding topographical and imaging detail at low voltages.”

The EVO series continues to offer full environmental capabilities, three chamber sizes and class leading X-ray geometry. Visit the ZEISS booth at Microscopy and Microanalysis this week to experience these improvements first-hand.

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