November 19, 2010 - Formulated to cushion and protect sensitive electronic circuits, components, and devices, Green Potting and Encapsulating Compound is moisture-resistant and imparts very little stress on components during cure or thermal cycling. Raw materials are listed under different FDA CFR 21 Sections, allowing use in applications where there is direct food contact. Base Natural Oil Polyol is obtained directly from plant source without chemical modifications.

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Epoxies Etc.
21 Starline Way
Cranston, RI, 02921-3407, USA

Epoxies, Etc. has introduced a new elastomeric Potting and Encapsulating Compound developed for the protection of electronic circuits, components, and devices. This product is formulated to cushion and protect sensitive electronic components. The 20-2121 will impart very little stress on components during cure or thermal cycling.

20-2121 is FDA Compliant. The raw materials used in this product are listed under different FDA CFR 21 Sections which allow these materials to be used in applications where there is direct food contact.

The base Natural Oil Polyol (NOP) used in the 20-2121 is obtained directly from a plant source without chemical modifications. Due to the raw materials selected, this product is low in toxicity and considered a GREEN Potting Compound.

Features:

Low Viscosity

FDA Compliant

Low Durometer

Low Shrinkage and Exotherm

Low Toxicity

Geen

Moisture Resistant

Samples are readily available. Call today to discuss your Potting and Encapsulating Application with Technical Engineer.

Contacts: View detailed contact information.