December 1, 2010 - Designed to cure at room temperature, 2-component 20-2125 Potting, Encapsulating, and Casting Resin cushions and protects sensitive electronic components while imparting very little stress on components during cure or thermal cycling. Hardness can be modified by changing mix ratio of Polyol and Isocyanate. Moisture-resistant with low toxicity, product can be used in wet environments and minimizes employee exposure to dangerous chemicals.

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Epoxies Etc.
21 Starline Way
Cranston, RI, 02921-3407, USA

Epoxies, Etc. develops a new Potting, Encapsulating, and Casting resin. The 20-2125 is a two-component, low viscosity, room temperature curing system. This is an easy to use polyurethane that will cushion and protect sensitive electronic components. It will impart very little stress on components during cure or thermal cycling due to its low durometer.

A unique feature of this product is the ability to modify the hardness by simply changing the mix ratio of the Polyol and Isocyanate.

Features:                        Benefits:

Adjustable Hardness        Durometer can be modified for different applications

Low Toxicity               Reduce employee exposure to dangerous chemicals

Green                      Reduce demand on non-renewable fossil fuels

Low Viscosity              Quick self leveling around components

Low Durometer              Low stress on components & vibration resistant

Moisture Resistant         Can be used in wet environments

Low Shrinkage & Exotherm   Will not damage components during cure

Samples are available and may be requested from our website: www.epoxies.com

Contacts: View detailed contact information.