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Photopolymer offers glass-like clarity.

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November 9, 2004 - RenShape® SL 7570 is a transparent stereolithography photopolymer for building flow visualization and form-and-fit models and prototypes. Heat deflection temperature of 140°F ensures dimensional stability and resistance to distortion. Applications include models and prototypes of package designs, optical guides, toys, medical devices, and electronic equipment fascias. Material is also suited for making QuickCast™ patterns and masters for RTV silicone rubber moldmaking.

(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)
Original Press release

Huntsman Advanced Materials Americas Inc.
2190 Executive Hills Blvd.
Auburn Hills, MI, 48326
USA


New Huntsman SL Photopolymer Combines Glass-like Clarity and High Strength

AUBURN HILLS, Michigan, November 3, 2004 – A new, high-strength, transparent stereolithography (SL) photopolymer for building high-quality concept, flow visualization and form-and-fit models and prototypes is now available from the RenShape® Solutions Group of Huntsman Advanced Materials. Typical applications for the new glass-like RenShape® SL 7570 photopolymer include models and prototypes of new package designs, optical guides, toys, medical devices and electronic equipment fascias. The low-viscosity material is also well suited for making QuickCast™* patterns and masters for RTV silicone rubber moldmaking.

Among characteristics that distinguish RenShape SL 7570 photopolymer from other clear SL materials are its reliable processability, easy cleaning/finishing, and higher flexural and tensile strengths. The new product also has the highest heat deflection temperature (60°C/140°F) available for a transparent SL material to ensure good dimensional stability and resistance to distortion in models. RenShape SL 7570 photopolymer generates accurate parts with good reproduction of intricate designs and dimensional details. The new product is formulated for use on solid-state platforms including the Viper™* si2 and SLA®* 3500/5000/7000 systems.

For more information about RenShape SL 7570 photopolymer, contact Tammy Ritter, Huntsman Advanced Materials Americas Inc., 2190 Executive Hills Blvd., Auburn Hills, MI 48326, 248-322-7496, e-mail: slmaterials@huntsman.com, website: http://www.renshape.com/.

Huntsman’s RenShape Solutions Group manufactures and markets a broad range of photopolymers, epoxies and polyurethanes for modeling, moldmaking, prototyping and forming initial parts used in the automotive, foundry, aerospace and general manufacturing industries.

Huntsman Advanced Materials is a global and marketer of advanced epoxy resins, adhesives, coating systems, electrical insulating materials, printed circuit board technology, tooling materials and structural composites. We service end-use markets that include the aerospace, automotive, telecommunications, electrical and electronics, recreation and appliance industries.
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