Photoetched Lead Frames combine strength and flexibility.October 1, 2007 -
Photochemically-etched on one or both sides, SMT and insert-mount lead frames are designed for IC manufacturing. They can be plated, in their entirety or selectively, using base materials such as kovar, nickel-iron alloys, copper alloys, and pure nickel depending on electrical and thermal conductivity requirements. Lead-free plating materials include silver, nickel, gold, or tin. Lead frames range in thickness from 0.5-40 mil, with features as small as 4 mil on 0.010 in. centers.
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Original Press release
Photofabrication Engineering Inc.
500 Fortune Blvd.
Milford, MA, 01757
USA
Photoetched Lead Frames Meet Exacting Electrical, Thermal Conductivity, and Strength Requirements
August 29, 2007...PHOTOFABRICATION ENGINEERING (PEI), Milford, MA, manufactures a complete line of photochemically-etched surface-mount and insert-mount lead frames for integrated circuit manufacturing. These lead frames are used in a wide variety of applications including semiconductors, glass-to-metal seals, relays, and are also used in medical applications such as hearing aids.
Using base materials such as kovar, nickel-iron alloys, copper alloys, and pure nickel, PEI can plate lead frames in their entirety or selectively. Lead-free plating materials include silver, nickel, gold, or tin, depending on the customer's specific electrical and thermal conductivity requirements. Since the lead frame is the main conduit by which heat flows from the chip to the printed circuit board, PEI tailors the manufacturing material so that it will maximize the device's operating life for any given application or environment.
PEI manufactures high-density lead frames with acute profiles and ultra-fine pitches, allowing for high pin counts. Single- or double-sided lead frames can be etched without incurring the stresses associated with typical machining methods. More importantly, PEI's process can be used for lead frames that are too complicated for stamping. Dimensions can be held to extremely tight tolerances, with no burrs or other surface irregularities.
PEI's lead frames range in thickness from 0.5 mil [0.0127 mm] to 40 mil [1.575 mm], with features as small as 4 mil [0.10 mm] on 0.010 in. [0.254 mm) centers, creating lead frames that are strong enough to be handled yet flexible enough to allow bending when necessary.
A significant advantage of photochemical etching is the ability to reproduce large quantities of parts without tooling "wear," so the millionth part is exactly the same as the first part. Changes to tools can be implemented very quickly, and phototools are significantly less expensive than traditional tooling methods-ideal for manufacturing plates from prototype to production quantities. Turnaround time using phototools is about 90% less than that for stamped frames.
For more information about our lead frames and other photoetched products, contact Chip Lehrer, Vice President, PHOTOFABRICATION ENGINEERING, INC., 500 Fortune Boulevard, Milford, MA 01757; telephone +(508) 478-2025; FAX +(508) 478-3582; or visit our Web site, www.photofabrication.com.
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