Phase Change Material provides natural tack.

Press Release Summary:



Featuring thermal impedance of 0.17°C-in²/W at 50 psi, Hi-Flow® 330P is suited for use between high-power electrical device requiring electrical isolation and its heat sink. With polyimide film reinforcement, top side is dry and bottom side has natural tack. Material is available in standard roll size of 11 in. by 250 ft and comes in thicknesses of 0.0045, 0.0050, and 0.0055 in. Applications include power supplies, IGBTs, discrete components, and automotive systems.



Original Press Release:



Natural Tack Enhances Handling Characteristics and Dispensability



Hi-Flow®330P assures easy dispensing and excellent thermal performance for
high power applications.

CHANHASSEN, MN - The Bergquist Company announces the latest addition to its family of thermally conductive phase change materials, Hi-Flow 330P. Hi-Flow 330P has excellent handling characteristics. With a polyimide film reinforcement, its top side is dry
to the touch and its bottom side has a natural tack. The polyimide film reinforcement gives Hi-Flow 330P high dielectric strength and cut-through resistance. Hi-Flow 330P's thermal performance is exceptional with a thermal impedance of 0.17ºC-in2/W at 50 psi.

Hi-Flow 330P is a high performance material appropriate for power supplies, IGBT's, discrete components and automotive applications. The material is ideal for use between a high power electrical device requiring electrical isolation and its heat sink.
Hi-Flow 330P provides a thermal performance equal to or greater than any insulated thermal interface material on the market, with a natural tack for added ease of handling and dispensing benefits.

Hi-Flow 330P is available in sheet and bulk roll form with tabulated parts. Thicknesses of 0.0045", 0.0050" and 0.0055" are standard offerings. Standard roll size is 11" x 250'. Consult your Bergquist Sales representative for custom thicknesses, sizes, and die-cut shapes. Domestic high-volume pricing, based on 10,000 pieces of 1" x 1" x 0.005", is $0.186 for Hi-Flow 330P1.5. For additional pricing, please contact a Bergquist Sales representative.

The Bergquist Company designs and manufactures high performance thermal management materials used to dissipate heat and keep electronic components cool. Headquartered in Chanhassen, MN, Bergquist supplies the world with some of the best-known brands in the business: Sil-Pad® thermally conductive interface materials, Gap Pad® electrically insulating gap fillers, Hi-Flow® phase change grease replacement materials, Bond-Ply® thermally conductive adhesive tapes, and Thermal Clad® insulated metal substrates.

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