Parallel FIFO takes unlimited amount of data.
Press Release Summary:
Radiation shielded Model 7206F high-speed Epi-CMOS FIFO microcircuit is organized so that data is read in same sequential order that it was written, and Full, Half Full, and Empty Flags are provided to prevent overflow and underflow. Expansion logic allows unlimited expansion capability in word size and depth with no timing penalties. Twin address pointers automatically increment with write and read pin.
Original Press Release:
Maxwell Technologies Introduces High-Speed Epi-CMOS Parallel FIFO
* 16Kx 9-Bit Organization
* Excellent Single Event Effect
* Asynchronous Read/Write Operation
* High Speed CMOS Epi Technology
* Retransmit Capability
* Maximum Access Times of 15, 20, 30, 40, and 50 ns
* Full Expandable in Both Word Depth and Width
* Bi-Directional Applications
* Low Power
* Batterv Back- Up Operation
* TTL Compatible
San Diego, CA - Maxwell Technologies, Inc. introduces the 7206F high-speed FIFO microcircuit, which features greater than 100 krad (Si) total dose tolerance. The 7206F is organized in such a way that the data is read in the same sequential order that it was written, and Full, Half Full, and Empty Flags are provided to prevent overflow and underflow. The product's expansion logic allows unlimited expansion capability in word size and depth with no timing penalties. The twin address pointers of the 7206F automatically increment with the write and read pin. The product's 9-bits wide data are used in data communications applications where a parity bit for error checking is necessary. The retransmit capability of the 7206F allows the read pointer to be reset to its initial position without affecting the write pointer.
"Maxwell's 7206F offers the highest density radiation tolerant FIFO available in the industry," said Larry Longden, Director of Product Development for Maxwell. "It also offers the flexibility of variable word width, controlled by simply connecting the corresponding input control signals of multiple devices."
The 7206F comes in a 28-Pin RAD-PAK® Flat Package, and is available with screening up to Class S. The product utilizes Maxwell Technologies' patented RAD-PAK® packaging technology, which incorporates radiation shielding in the microcircuit package. The process eliminates the need for box shielding while providing the required radiation shielding for a lifetime in orbit.
Maxwell Technologies manufactures and markets high-reliability power and computing components and automated test instruments. The company's microelectronic products include power modules, integrated circuits and single board computers that combine commercial-off-the-shelf (COTS) components and Maxwell's proprietary radiation shielding technology to provide optimal performance and reliability in aerospace, military and other applications. Maxwell's PowerCache ultracapacitors are high-density energy storage cells that deliver bursts of high power on demand in applications such as automotive electrical systems and powertrains, wireless communications and consumer and industrial electronic devices. The company's instrument products include automated accelerated reliability test systems (AARTS) for RF and photonic components.
