PIN Diodes come in MELF package.March 7, 2007 -
Housed in non-magnetic, metal electrode leadless faced package, PIN Diodes are designed for switching and attenuator applications from HF-UHF frequencies. Units feature resistance of 0.3-1.0 W at 100 MHz and 100 mA, and capacitance range of 0.5-2.0 pf at 1 MHz and 100 V. Manufactured using glassing process, which provides full-face bonding on anode and cathode, hermetically sealed devices come in surface mount CS127-1 ceramic package and standard MELF CS127-4.
(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)
Original Press release
Micrometrics
136 Harvey Road Bldg. C
Londonberry, NH, 03053
USA
High Power PIN Diodes Now Available in MELF Package
February 15, 2007-Londonderry, NH-MicroMetrics, a manufacturer of RF/Microwave Diodes and passive Semiconductor Devices for commercial and military communications, has announced the release of new non-magnetic metal electrode leadless faced (MELF) packaged PIN Diodes that feature high power handling and low distortion. These MELF PIN Diodes are designed for switching and attenuator applications from HF through UHF frequencies. They're manufactured using MicroMetrics' propriety glassing process which features full-face bonding on the anode and cathode of the device to ensure full surface contact of the square ceramic package. This creates lower electrical and thermal resistance and provides higher average performance at RF power levels up to 100 Watts CW. They also feature low series resistance which leads to low inductance characteristics, and low junction capacitance, which delivers high isolation.
The product family has resistance specification at 100 MHz from 0.3 ohms to 1.0 ohms @ 100mA, capacitance specifications at 1 MHz of 0.5 pF to 2.0 pF @ 100 V, and lifetime specifications from 1.0 µsec to 8.00 µsec. As a result, this family of PIN devices has lifetime specifications that will allow for lower intermod distortion and have a higher average incident power handling capability. The electrical and mechanical specifications of these devices meet the requirements of MRI systems.
These hermetically sealed devices have been designed for high volume tape and reel assembly utilizing the ceramic package flat surface for automatic pick and place assembly or vacuum pickup techniques. All solder surfaces are tin plated and compatible with reflow soldering methods. Package types available include the new surface mount ceramic package CS127-1 and standard MELF CS127-4. These devices can also be delivered in chip form or in custom specified packages.
Prices and delivery schedules vary depending on electrical parameters and quantity required. Average lead time is 4-6 weeks.
About MicroMetrics www.micrometrics.com
Established in 1986, MicroMetrics, Inc. is a privately held, full service manufacturer of standard and custom RF/Microwave diodes and passive semiconductor devices. They are one of the largest suppliers of custom semiconductors to the U.S. military and among the leading suppliersof diodes to the commercial wireless industry. All design and manufacturing is completed in-house in their fully equipped, 43,000 square foot, ISOcertified facility in Londonderry, NH. Specific devices that are manufactured include: tuning varactors, step recovery diodes, PIN/NIP/limiter diodes,Schottky diodes, attenuator pads, point contact diodes, chip capacitors, resistors, spiral inductors, abrupt and hyperabrupt varactors, mixer/detectors,Zener diodes, MELFs, and JAN qualified devices.
Contacts:
Donna Langan
MicroMetrics
54 Grenier Field Road
Londonderry, NH 03053
www.micrometrics.com
603-641-3800
dlangan@micrometrics.com
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