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Non-Conductive Paste promotes flip chip application reliability.

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February 6, 2014 - Designed for flip chip packaging applications, 585-1 Non-Conductive Paste (NCP) promotes reliability for gold stud bump interconnects. Ionically clean product, which cures in seconds during thermal compression bonding at 200°C, exhibits optimized fracture toughness as well as adhesion.

Engineered Material Systems Introduces New Non-Conductive Paste

Engineered Materials Systems Inc.
132 Johnson Dr.
Delaware, OH, 43015

Press release date: January 1, 2014

DELAWARE, OH – Engineered Material Systems (EMS), a leading global supplier of electronic materials for electronics applications, debuts its 585-1 Non-Conductive Paste (NCP) designed for flip chip packaging applications. This new NCP is designed to provide high reliability to the gold stud bump interconnects used in flip chip packaging.

585-1 has very high fracture toughness, adhesion, is ionically clean and cures in seconds during thermal compression bonding at 200°C. It is the latest addition to Engineered Material Systems’ extensive line of electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive, printed electronic and photonic applications.

For more information about 585-1 NCP or to learn how Engineered Material Systems can define, develop and create an engineered material solution that is right for your company, visit

About Engineered Material Systems
Engineered Materials Systems, Inc. (EMS) technology focus is on electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive, printed electronics and photonics assembly product lines. The company creates continual improvements that will guide its customers into the future. For more information, visit
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