Multilayer Ceramic Capacitor features open mode design.August 9, 2011 -
With capacitance from 1,000 pF to 6.8 µF, FO-CAP MLCC combines open mode chip design and flexible termination. Open Mode component utilizes internal electrode, which minimizes possibility of short circuit condition if mechanically damaged. Flexible Termination component, utilizing conductive silver epoxy, establishes pliability while maintaining terminal strength and solderability. Available in DC voltage ratings of 16, 25, 50, 100, and 200 V, RoHS-compliant device operates from -55 to +125°C.
Original Press release
Kemet Electronics Corp.
P.O. Box 5928
Greenville, SC, 29606
USA
KEMET Introduces FO-CAP Combining Flexible Termination with Open Mode Chip Design Technology
GREENVILLE, S.C., -- KEMET Corporation (NYSE: KEM),a leading manufacturer of tantalum, ceramic, aluminum, film, paper and electrolytic capacitors, today announced the addition of the FO-CAP to its Multilayer Ceramic Capacitor (MLCC) flex solutions portfolio.
The FO-CAP combines two existing KEMET technologies - Open Mode Chip Design and Flexible Termination. The Open Mode component utilizes an internal electrode design which minimizes the possibility of a short circuit condition if mechanically damaged (cracked). The Flexible Termination component utilizes a conductive silver epoxy in order to establish pliability while maintaining terminal strength, solderability and electrical performance. The combination of these two technologies provides the highest level of protection against the onset of mechanical failures that may occur during extreme environmental or handling conditions.
"KEMET's FO-CAP addresses concerns for more flex-robust and reliable products in automotive and general electronics applications," said Tim Hollander, KEMET Specialty Product Manager. "This proven technology is available in commercial and automotive grade, and provides superior flex performance and improved reliability while minimizing the risk of a catastrophic and costly failure."
Flexible Termination technology was developed to address flex cracks, the primary failure mode of surface mount MLCCs. This technology directs circuit board stress away from the ceramic body and into the termination area, therefore reducing the risk of mechanical damage to the component that can result in low IR or short circuit failures.
Technical Information
-- Operating temperature range of -55 degrees C to +125 degrees C
-- Open Mode/fail open design
-- Mid to high capacitance flex mitigation
-- Pb-Free and RoHS compliant
-- X7R Dielectric (Temperature Characteristic = +/- 15% from -55 degrees C to +125 degrees C)
-- EIA 0805, 1206, 1210 and 1812 case sizes
-- DC voltage ratings of 16V, 25V, 50V, 100V and 200V
-- Capacitance offerings ranging from 1000pF to 6.8 micro F
-- Available capacitance tolerances of +/- 5%, +/- 10% and +/- 20%
-- Non-polar device, minimizing installation concerns
-- 100% pure matte tinplated termination finish allowing for excellent solderability
-- SnPb termination finish option available upon request (5% min)
-- Commercial and Automotive (AEC-Q200) grades available
About KEMET
KEMET's common stock is listed on the NYSE under the symbol "KEM." At the Investor Relations section of our web site at http://www.KEMET.com/IR, users may subscribe to KEMET news releases and find additional information about our Company. KEMET applies world class service and quality to deliver industry leading, high performance capacitance solutions to its customers around the world and offers the world's most complete line of surface mount and through-hole capacitor technologies across tantalum, ceramic, film, aluminum, electrolytic, and paper dielectrics. Additional information about KEMET can be found at http://www.kemet.com.
Web Site: http://www.kemet.com
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