Multi-Level Stencils reduce need for post-print rework.
October 21, 2005 -
Multi-level stencil helps ensure that appropriate paste volumes are deposited for all components, from power and I/O connectors to discretes and fine-pitch devices of all types, in one squeegee pass. This is achieved by controlling thickness of stencil in selective areas across its surface, local to each component; apertures in thinner areas deliver less paste, and apertures in thicker areas deliver more paste.
(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)
Original Press release
Tecan
30021 Tomas Street, Suite 300
Rancho Santa Margarita, CA, 92688
USA
Multi-Level Stencils Optimise Post-Print Rework Costs
World-leading stencil manufacturer, Tecan, is ramping up production of its multi-level stencils to meet increasing demand from PCB builders who are increasingly recognizing the cost benefits they bring by substantially reducing the need for post-print rework, in both traditional and lead-free production facilities.
Key to the success of any solder paste print process is the deposition of exactly the right volume of paste to each and every pad. This is increasingly difficult using traditional stencils as printed circuit boards become more complex and typically contain a wide variety of different size and pitch components - each with their own paste volume and coplanarity requirements. To minimize rework, it is necessary to ensure that the appropriate paste volumes are deposited for all components, from power and I/O connectors to discretes and fine-pitch devices of all types, in a single squeegee pass.
The Tecan multi-level stencil is critical in delivering exactly the required amount of paste to each pad. Fundamentally, this is achieved by controlling the thickness of the stencil in selective areas across its surface, local to each component, so that apertures in the thinner areas deliver less paste and apertures in the thicker areas deliver more paste. In addition to delivering the ideal paste deposit, the technique avoids the problems associated with traditional attempts to selectively increase paste deposits by increasing the size of apertures in the X or Y axes, which can result in pad proximity problems such as short circuits.
Increasingly, PCB manufacturers are realizing the significant cost savings that can be made by minimizing post-print rework - through optimizing the print process itself - by employing the proven multi-level stencil.
UK Company contact - Mark Lowe, Head of Marketing, Tecan, Tecan Way, Granby Ind. Est. Weymouth, Dorset, DT4 9TU. Tel: 01305 765432. Fax: 01305 780194. sales@tecan.co.uk - www.tecan.co.uk
USA Company contact - Noel Cherowbrier, VP International Development, Tecan, 30021 Tomas Street, Suite 300, Rancho Santa Margarita, CA 92688, USA. Tel: 1-877-998-3226 (toll free). Fax: 1-877-990-4700 (toll free). sales@tecan-inc.com - www.tecan-inc.com
Colour separations - The cost of colour separations may be considered - contact Jill Steer, Tecan, Tecan Way, Granby Ind. Est., Weymouth, Dorset,
DT4 9TU. Tel: 01305 765432. Fax: 01305 780194. jill@tecan.co.uk
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