Miniature Thermoelectric Modules offer optimal heat dissipation.
February 5, 2014 -
Built using Tlam thermally conductive circuit boards, Tlam OptoTEC® series is designed for applications where temperature stabilization of sensitive optical components is critical. Circuit boards have thin layer of thermally conductive dielectric material between copper foil layer and metal backing plate. Comprising 7 modules, series can create temperature differential (ΔT) of up to 67°C and pump from 1.5–9.0 W of heat at 25°C. At 85°C, series can create ΔT of 77°C and pump 1.6–9.9 W of heat.
|Original Press Release |
16401 Swingley Ridge Rd., Suite 600
Chesterfield, MO, 63017
Laird's New Tlam OptoTEC Series Moves Heat in a Different Direction
New thermoelectric series to Launch at Photonics West 2014, booth #5435 on February 4-6 at the Moscone Center in San Francisco
Laird, a global technology company, has announced a new series of miniature thermoelectric modules (TEMs) built using Laird Tlam thermally conductive circuit boards instead of traditional ceramic-based circuit boards. The Tlam OptoTEC® series is designed for applications where temperature stabilization of sensitive optical components in photonics, telecom, medical and consumer markets is critical. The use of the circuit board improves the heat pumping capabilities of the device while providing excellent heat spreading, improved reliability and lower cost in high volume when compared to traditional heat removal systems.
Tlam is used in applications where the components in the circuit produce a lot of heat, such as high powered LEDs, power supplies or motor drives. Tlam circuit boards feature a thin layer of thermally conductive dielectric material sandwiched between a top layer of standard copper foil and a thick metal backing plate for structural strength and improved heat spreading. Traditional ceramic-based circuit boards have very poor thermal conductivity, so any heat produced by the circuit must radiate from the top of the circuit board. With Tlam, the heat is transported off the bottom of the circuit board where the metal backing plate quickly carries heat laterally away from hot components, reducing their temperature and extending their lifetime. The combination of the Tlam circuit board with the thermoelectric offers a completely new way to design thermal rejection systems and can reduce the complexity of moving heat away from sensitive devices.
The Tlam OptoTEC series includes seven new modules that can create a temperature differential (ΔT) of up to 67°C and pump from 1.5 to 9.0 watts of heat at an ambient temperature of 25°C. At 85°C, the series can create a ΔT of 77°C and pump 1.6 to 9.9 watts of heat. The modules have passed Telcordia GR-468-CORE Issue 2 reliability qualification testing and are easily customizable to accommodate alternate sizes, heat pumping capacities, unique circuit patterns and pre-tinning requirements. A white paper, application note and datasheets for the Tlam OptoTEC series are available for downloading at here.
"Laird is the only company in the world that makes both TEMs and thermally conductive circuit boards," says Andrew Dereka, product manager at Laird. "We are uniquely positioned to offer innovations based on this combination of thermal management technologies to our customers."
The Tlam OptoTEC series modules are available with an 8 to 10 week delivery lead time. Pricing is available upon request.
In addition to the Tlam OptoTEC series, Laird will display a wide range of thermoelectric modules and thermoelectric assemblies for thermal management of photonics and optoelectronics at Photonics West, which takes place on February 4-6 at the Moscone Center in San Francisco, California. Laird will exhibit at booth #5435.
Laird provides the knowledge, innovation and resources to ensure exceptional thermal performance and customer satisfaction for thermoelectrics and liquid cooling solutions for laser systems.
Laird is a global technology business focused on enabling wireless communication and smart systems, and providing components and systems that protect electronics. Laird operates through two divisions, Wireless Systems and Performance Materials. Wireless Systems solutions include antenna systems, embedded wireless modules, telematics products and wireless automation and control solutions. Performance Materials solutions include electromagnetic interference shielding, thermal management and signal integrity products. As a leader in the design, supply and support of innovative technology, our products allow people, organisations, machines and applications to connect effectively, helping to build a world where smart technology transforms the way of life. Custom products are supplied to major sectors of the electronics industry including the handset, telecommunications, IT, automotive, public safety, consumer, medical, rail, mining and industrial markets. Providing value and differentiation to our customers through innovation, reliable fulfilment and speed, Laird PLC is listed and headquartered in London, and employs over 9,000 people in more than 58 facilities located in 18 countries.
For additional information, visit http://www.lairdtech.com or contact us at:
Americas: +1-888-246-9050 option 2
Asia: +86-755-2714-1166 x374
Translated versions of this press release are available in Simplified and Traditional Chinese, Japanese, Korean, and German languages.
© 2014 All rights reserved. Laird, Laird Technologies and the respective logos are trademarks owned by Laird Technologies, Inc. and/or Laird PLC, either directly or indirectly through one or more subsidiaries. Other products, logos, and company names mentioned herein, may be trademarks of their respective owners.