Microformed Chip Shield is designed for portable devices.
July 7, 2009 -
Manufactured to ultra thin dimensions, ChipShield® provides EMI/RFI shielding during manufacturing of chip packages and can replace existing technology with little to no change to existing chip fab process. It is offered in tape and reel and can be adapted to most pick and place equipment for installation directly onto chip. Custom configurations can be created to meet requirements for rapidly changing products.
(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)
Original Press release
Autosplice
10121 Barnes Canyon Rd.
San Diego, CA, 92121
USA
New ChipShield® Micro Formed Technology Provides EMI/RFI Shielding at the Chip Level
Autosplice Expands RF Solutions Portfolio
San Diego, Calif. - June 22, 2009 - Autosplice, a leading electronic interconnect solutions company, announced the addition of a micro formed chip shield to its portfolio of RF solutions for mobile phones and other portable devices. These new ChipShields® cost-effectively provide shielding during the manufacturing of the chip packages. The shields are manufactured to ultra thin dimensions and the tooling can be produced in a fraction of the time and at much lower costs than with traditional stamping tools.
The increasing challenges of real estate in portable devices have created demand for the next generation of shielding whether on the board or in the chip. The new Autosplice process provides greater flexibility for both the chip manufacturers and the device manufacturers to replace existing technology. Unlike spray methods which require extensive capital investment, the ChipShield requires little to no change to the existing chip fab process. The shields are provided by Autosplice in tape and reel and can be adapted to most pick and place equipment for installation directly onto the chip. Custom configurations can be developed and produced in short lead times to meet requirements for rapidly changing products.
According to Autosplice President, Michael T. Reagan, "We have been developing this technology for a few years and are excited about the potential it offers to replace existing shielding methods and offer enhanced Shielding Effectiveness due to our seamless technology. Our portfolio of RF Solutions, including traditional stamped cans, shield clips and now the ChipShield, offer our customers various cost effective solutions to meet their EMI shielding needs."
Autosplice is a 55 year old multi-national innovation and electrical interconnect solutions provider for the global markets of Industrial, Medical, Automotive, and Telecom. Thecompany's diverse product portfolio encompasses application specific interconnects,precision metal stampings, continuous molded interconnects, shape memory alloy assemblies, printed circuit board assemblies and insertion equipment. Autosplice operates in nine countries around the globe; USA, Mexico, Brazil, UK, Germany, Japan, Korea, Singapore, and China.
For More Information:
Company contact:
Ken Krone,
Phone 858-678-3102,
Email kkrone@autosplice.com
For more information on Autosplice's products or to discuss unique applications, contact Autosplice at (800) 535-5538 or visit our Web Site at www.autosplice.com
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